Snapdragon X Plus
Qualcomm Snapdragon X Plus vs AMD Ryzen 5 7235H
CPU Comparison Result
Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon X Plus and AMD Ryzen 5 7235H processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
Qualcomm
AMD
Launch Date
April 2024
April 2024
Platform
Laptop
Laptop
CPU Architecture
64-bit architecture
-
CPU Name
Qualcomm Oryon CPU
-
Part Number
X1P-64-100
-
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Qualcomm Snapdragon X Plus X1P-64-100
Ryzen 5 7235H
Code Name
-
Zen 3+ (Rembrandt R)
CPU Specifications
Boost Frequency
None
-
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
-
8
Performance-cores
-
4
Performance-core Base Frequency
-
3.2 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
-
4.2 GHz
L1 Cache
-
384 KB
L2 Cache
-
2 MB
L3 Cache
-
8MB
Bus Frequency
-
100MHz
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
42 MB
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
FP7r2
Multiplier
-
32x
Unlocked Multiplier
-
No
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4nm
6 nm
TDP
-
35-53 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
95°C
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-
x86-64
Memory Specifications
Memory Bus Width
16-bit x 8 channels
-
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x
DDR5-4800
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
64GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
2
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
76.8 GB/s
Maximum Memory Speed
8448 MT/s
-
ECC Memory Support
-
Yes
GPU Specifications
Display Processing Unit
Qualcomm Adreno DPU
-
External Display Standard
DisplayPort 1.4
-
GPU APIs
DirectX 12
-
GPU Name
Qualcomm Adreno GPU
-
GPU Part Number
X1-85
-
Max External Display Resolution
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz
-
Max On-Device Display Resolution
Up to UHD120 HDR10
-
On-Device Display Standard
eDP v1.4b
-
Video Concurrency
4K 60 FPS 8-bit and 10-bit decode + 4K UHD 30 FPS 8-bit encode + 4K UHD 30 FPS 8-bit Miracast
-
Video Decode
4K 60 FPS 10-bit HEVC, VP9, AV1; 4K 60 FPS 8-bit H.264; 4K 120 FPS 8-bit HEVC
-
Video Encode
4K UHD 30 FPS 8-bit HEVC, AV1; 4K UHD 60 FPS 8-bit H.264
-
Video Processing Unit
Qualcomm Adreno VPU
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
False
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1.25 GHz
-
Graphics Performance
3.8 TFLOPS
-
AI Specifications
Micro NPU
Dual Micro NPU on the Qualcomm Sensing Hub
-
NPU Name
Qualcomm Hexagon NPU
-
NPU Performance
45 TOPS
-
Connectivity
Bluetooth Connection Technology
Bluetooth LE
-
Bluetooth Version
Bluetooth 5.4
-
Cellular Bandwidth
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
-
Cellular Modem
Snapdragon X65 5G Modem-RF System
-
Cellular Peak Download Speed
10 Gbps
-
Cellular Peak Upload Speed
3.5 Gbps
-
Wi-Fi Bands
6 GHz, 5 GHz, 2.4 GHz
-
Wi-Fi Standard
Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6; 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
-
Wireless System
Qualcomm FastConnect 7800 Mobile Connectivity System
-
Interfaces and Ports
SD Standard
SD v3.0
-
UFS Version
4.0
-
USB Interface Type
3x USB-C; 3x USB4, 2x USB3.2 Gen2, 1x eUSB2
-
USB Version
USB4
-
PCIe Lanes
-
20
Miscellaneous
Always Sensing
Supported
-
Audio Technology
Qualcomm Aqstic Audio technology, Qualcomm aptX Audio
-
Dual Camera Support
2x 36 MP
-
Image Signal Processor
Qualcomm Spectra ISP
-
ISP Bit Width
Dual 18-bit ISPs
-
Single Camera Support
Up to 64 MP
-
Video Capture
4K HDR
-
Advantages
Snapdragon X Plus
- More Total Cores: 10 (10 vs 4)
- Higher Technology: 4nm (4nm vs 6 nm)
- Newer Launch Date: April 2024 (April 2024 vs April 2024)
SiliconCat Rating
87
Ranks 87 among Laptop CPU on our website
319
Ranks 319 among all CPU on our website
