Snapdragon X Plus
Qualcomm Snapdragon X Plus vs AMD Ryzen 5 7640H
CPU Comparison Result
Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon X Plus and AMD Ryzen 5 7640H processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
Qualcomm
AMD
Launch Date
April 2024
January 2023
Platform
Laptop
Mobile
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1P-64-100
Ryzen 5 7640H
Code Name
Oryon
Phoenix
Generation
-
Ryzen 5 (Zen 4 (Phoenix))
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
6
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
10
12
Performance-cores
10
-
Basic Frequency
-
4.3 GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
up to 5 GHz
Performance-core Base Frequency
3.4 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3.4 GHz
-
L1 Cache
-
64 KB (per core)
L2 Cache
-
1 MB (per core)
L3 Cache
42MB
16 MB (shared)
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
AMD Socket FP8
Bus Frequency
-
100 MHz
Multiplier
-
43.0x
Multiplier Unlocked
-
No
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
4 nm
TDP
23-65 W
35 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
100°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
Gen 4, 20 Lanes (CPU only)
Transistors
-
25,000 million
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8448
DDR5
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64GB
-
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Dual-channel
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
-
ECC Memory
-
Yes
GPU Specifications
GPU Name
Qualcomm® Adreno™
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
Radeon 760M
Graphics Performance
3.8 TFLOPS
-
Advantages
Snapdragon X Plus
- More Total Cores: 10 (10 vs 6)
- Larger L3 Cache: 42MB (42MB vs 16 MB (shared))
- Newer Launch Date: April 2024 (April 2024 vs January 2023)
SiliconCat Rating
41
Ranks 41 among Laptop CPU on our website
201
Ranks 201 among all CPU on our website
