Qualcomm Snapdragon X Plus vs Intel Core i7-13700

Specifications of CPUs

CPU Comparison Result

Introduction

In recent years, processor architectures have evolved rapidly, powering everything from data centers and desktop PCs to mobile devices and ultraportable laptops. In this article, we will compare two fundamentally different solutions: the Qualcomm Snapdragon X Plus (an ARM-based platform for ultralight Windows devices) and the Intel Core i7-13700 (a hybrid x86 desktop CPU from the Raptor Lake family). Although both chips aim to deliver high performance and energy efficiency, they differ significantly in architecture, feature sets, target use cases, and pricing. Our goal is to give you an understanding of each platform’s strengths and limitations, based on up-to-date technical data and benchmark results.


Architecture and Cores

Qualcomm Snapdragon X Plus

  • CPU Cores: The Snapdragon X Plus SoC integrates either 8 or 10 custom Oryon cores.

    • The high-end X1P-64-100 model features 10 cores (10 threads) running up to 3.40 GHz.

    • A more cost- and power-optimized variant, X1P-42-100, has 8 cores with a maximum frequency of 3.20 GHz.

  • Process Node: Manufactured on TSMC N4 (4 nm), which offers high transistor density and low power consumption.

  • GPU: An integrated Adreno X1-85 GPU capable of up to 3.8 TFLOPS (in the 10-core variant) or around 1.7 TFLOPS (in the 8-core model). It includes 1,536 shader units operating up to 1.25 GHz.

  • NPU (AI Accelerator): A dedicated Hexagon NPU rated at up to 45 TOPS, optimized for on-device machine learning tasks such as image processing, content generation, and speech recognition.

Snapdragon X Plus was designed as part of Qualcomm’s push to bring ARM performance and energy efficiency to Windows laptops. Thanks to its 4 nm process and specialized IP blocks, it achieves an excellent balance between raw compute ability and long battery life.

Intel Core i7-13700

  • CPU Cores and Threads: A hybrid design combining 16 physical cores (8 “Performance” cores + 8 “Efficient” cores) and 24 threads (the Performance cores support Hyper-Threading).

    • Performance Cores (P-cores):

      • Base Frequency: 2.10 GHz

      • All-Core Turbo Boost: 5.10 GHz when all P-cores are loaded

      • Turbo Boost Max Technology 3.0: Up to 5.20 GHz on a favored core for single-threaded workloads

    • Efficient Cores (E-cores):

      • Base Frequency: 1.50 GHz

      • Turbo Frequency: Up to 4.10 GHz

  • Cache:

    • 30 MB Intel® Smart Cache (shared L3)

    • 24 MB L2 (1.5 MB per Performance core and 2 MB per cluster of Efficient cores)

  • Process Node: Built on Intel 7 (branded as “10 nm class,” roughly comparable to a 7–8 nm competitor node).

  • Thermal Design Power (TDP):

    • Processor Base Power (PL1): 65 W

    • Maximum Turbo Power (PL2): 219 W

  • Integrated GPU: Intel® UHD Graphics 770 with 32 Execution Units, a base clock of 300 MHz, and up to 1.60 GHz dynamic frequency. Supports DirectX 12 Ultimate, OpenGL 4.6, and Vulkan.

  • AI Acceleration:

    • Intel DL Boost (AVX-512 & VNNI) for faster inference on certain neural-network layers.

    • Intel GNA (Gaussian & Neural Accelerator) for efficient background audio/speech processing (availability depends on motherboard support).

The hybrid Raptor Lake architecture allows the i7-13700 to deliver high single-threaded throughput on its P-cores while E-cores handle lighter background tasks, improving overall multi-tasking and energy efficiency under mixed workloads.


Performance

Synthetic Benchmarks (Cinebench R23, Geekbench, etc.)

  • Snapdragon X Plus (X1P-64-100)

    • Cinebench R23 Single-Core: ≈ 1115 points

    • Cinebench R23 Multi-Core: ≈ 8150 points

  • Intel Core i7-13700

    • Cinebench R23 Single-Core: ≈ 2050–2100 points

    • Cinebench R23 Multi-Core: ≈ 21000–22000 points

These numbers show that the i7-13700 delivers roughly double the single-threaded performance and about 2–3× the multi-core throughput compared to Snapdragon X Plus. However, the Intel CPU can draw up to 219 W under heavy load, while Snapdragon X Plus peaks around 23–40 W, which dramatically affects sustained performance and power draw.

Real-World Applications

  • Web Browsing & Office Productivity

    • Both platforms handle daily web browsing (multiple tabs, document editing, video calls) well.

    • Snapdragon X Plus excels in battery life—up to 15–20 hours of light web surfing—and operates almost silently.

    • i7-13700 provides snappier responsiveness in heavy browser-based work (web IDEs, large spreadsheets), but laptops using it typically achieve only 5–7 hours of similar workloads on battery.

  • Code Compilation and Build Performance

    • On an i7-13700 desktop, building large C++, Go, Rust, or PHP/Laravel projects finishes up to twice or three times faster than on a Snapdragon X Plus laptop (even with equivalent RAM).

    • Snapdragon X Plus can compile ARM-targeted code reasonably (especially when using LLVM/Clang), but it still trails a high-end x86 desktop CPU in large multi-threaded builds.

  • Video Editing & 3D Rendering

    • i7-13700 paired with a discrete GPU (e.g., NVIDIA RTX or AMD Radeon) or leveraging AVX-512 instructions on the CPU yields efficient 4K/8K editing and rendering in Adobe Premiere Pro, DaVinci Resolve, or Blender.

    • Snapdragon X Plus can handle basic 1080p editing and encoding tasks (thanks to its NPU and hardware video codecs) but will struggle with 4K rendering, which can take significantly longer.

  • Gaming

    • i7-13700 in a desktop with a powerful GPU easily runs modern AAA titles at high or ultra settings (1440p or 4K), including ray tracing and VR.

    • Snapdragon X Plus is limited to lightweight or cloud-streamed gaming (GeForce NOW, Xbox Cloud Gaming). Native ARM game ports (e.g., Fortnite ARM build) run with reduced visuals and performance.


Graphics and Multimedia

Qualcomm Adreno X1-85 (Snapdragon X Plus)

  • Compute Performance: Up to 3.8 TFLOPS (10-core variant) or ~1.7 TFLOPS (8-core variant).

  • Shader Units: 1536 (6 Execution Units × 96 TMUs, 48 ROPs) at up to 1.25 GHz.

  • Video Codecs: Hardware decode/encode for H.264, H.265 (HEVC), VP9, and AV1 (depending on SoC version), allowing ultra-efficient 4K playback.

  • APIs Supported: OpenGL ES, Vulkan, OpenCL 2.0, and DirectX 12 via Windows Subsystem for Linux (WSL).

Intel® UHD Graphics 770 (i7-13700)

  • Compute Performance: Approximately 1.5 TFLOPS FP32 when fully loaded (32 Execution Units at up to 1.60 GHz).

  • Shader Units: 32 EUs supporting DirectX 12 Ultimate, OpenGL 4.6, and Vulkan 1.3.

  • Video Codecs: Intel® Quick Sync Video for hardware acceleration of H.264, HEVC (H.265), VP9, and AV1 (depending on driver/microcode).

  • Display Outputs (via motherboard/laptop electronics): HDMI 2.1 (up to 4K@60 Hz), DisplayPort 1.4a (up to 8K@60 Hz), eDP 1.4b on laptops.

Takeaway:

  • The Adreno X1-85 in Snapdragon X Plus is very efficient at media playback, light 3D tasks, and cloud gaming.

  • Even though Intel UHD 770 has fewer shader units, it supports a broader range of modern graphics APIs, making it more suitable for entry-level 3D workloads and enabling simple on-chip video editing and rendering. However, UHD 770 consumes more power for encoding/decoding tasks compared to the specialized video blocks and NPU on Snapdragon X Plus.


Power Consumption and Thermal Characteristics

Qualcomm Snapdragon X Plus

  • TDP (PL1):

    • 23 W for the 8-core X1P-42-100

    • 40 W for the 10-core X1P-64-100

  • Efficiency:

    • Under light loads (web browsing, office apps), the SoC can draw as little as 5–7 W, enabling silent operation and exceptional battery life (up to 15–20 hours of active use).

    • Under full CPU+GPU load, thermals typically remain in the 75–85 °C range in well-designed laptops, allowing for small, quiet cooling solutions.

  • Battery Life:

    • Up to 20 hours of mixed video streaming and web surfing.

    • Around 10–12 hours of office productivity (documents, spreadsheets, video conferencing).

Intel Core i7-13700

  • TDP (PL1): 65 W (base).

  • Maximum Turbo Power (PL2): 219 W under sustained heavy load.

  • Efficiency:

    • At idle or very light desktop use, the system with an i7-13700 can draw 10–15 W (CPU only, not counting other components).

    • Under typical office/web workloads, total power draw (CPU + motherboard + RAM + storage) ranges from 60–80 W.

    • Under demanding tasks (gaming, rendering, compilation), power consumption can spike to 125–200 W, requiring robust cooling (≥ 150 W TDP cooler) and a high-quality power supply.

  • Thermal:

    • P-cores can reach 90–95 °C under full load if cooling is borderline. To maintain stable turbo frequencies, a quality air tower cooler or liquid cooling loop is recommended.

Takeaway:

  • Snapdragon X Plus is optimized for sustained low-power operation, ideal for ultralight laptops where battery life and silence are paramount.

  • The i7-13700 prioritizes maximum performance and requires a desktop cooling ecosystem to manage higher power draw and temperatures.


Memory and Storage

Snapdragon X Plus

  • RAM:

    • LPDDR5x-8448 MT/s (8-channel) with peak bandwidth up to 135 GB/s.

    • Typically available in 16 GB or 32 GB soldered configurations, up to a maximum of 64 GB.

  • Storage:

    • No legacy SATA ports—laptops use PCIe 4.0 x4 NVMe SSDs or UFS 4.0 modules internally.

Intel Core i7-13700

  • RAM:

    • Supports either DDR5-5600 MT/s (up to 192 GB) or DDR4-3200 MT/s (up to 128 GB), depending on the motherboard.

    • Dual-channel memory configuration yields up to 89.6 GB/s bandwidth on DDR5 or about 50 GB/s on DDR4.

    • ECC support is available if the motherboard allows it.

  • Storage:

    • PCIe 5.0 x16 for discrete GPUs, PCIe 5.0 x4 for next-gen NVMe SSDs, plus backward compatibility with PCIe 4.0 and SATA 3.0 drives.

    • Up to 20 PCIe lanes for additional peripherals (besides the GPU).

Takeaway:

  • Snapdragon X Plus’s LPDDR5x memory offers very low latency and high efficiency but is not upgradeable beyond what the OEM provides (max 64 GB).

  • The i7-13700 platform provides flexibility in memory choice (DDR4 vs. DDR5), capacity up to 192 GB, ECC options, and more storage-interface options for high-performance SSDs and multiple HDD/SSD combos.


AI Support and Acceleration

Qualcomm Snapdragon X Plus

  • Hexagon NPU: Rated up to 45 TOPS, it can accelerate on-device AI workloads such as:

    • Photo/video enhancement (denoise, upscaling, style transfer)

    • Real-time speech recognition and translation

    • Generative AI inference (lightweight LLMs like Llama, Mistral Lite)

  • Windows Integration: Windows 11 on ARM can leverage the NPU for features like Windows Copilot+ (AI-powered text generation, context-aware suggestions), improved video call quality (background blur, noise suppression), and local language translation without hitting the cloud.

Intel Core i7-13700

  • Intel Deep Learning Boost: AVX-512 vector extensions and VNNI instructions can accelerate certain inference tasks on the CPU, delivering roughly 2–4 TOPS of AI performance depending on data type and optimization.

  • Intel GNA (Gaussian & Neural Accelerator): Found on some motherboards/chipsets, GNA offloads background AI tasks (e.g., always-on voice activation, noise suppression) very efficiently, but its availability depends on the system design.

Takeaway:

  • Snapdragon X Plus offers a dedicated, high-throughput NPU that outperforms CPU-only AI inference by a wide margin, making it ideal for users who want fast local AI features without cloud dependency.

  • The i7-13700 can run AI inference on the CPU reasonably well via AVX-512 but cannot match the dedicated NPU performance. GNA provides limited background AI acceleration in compatible PCs but is not a full substitute for a high-power NPU.


Compatibility and Ecosystem

Windows on ARM (Snapdragon X Plus)

  • Operating System: Officially supports Windows 11 on ARM.

  • Application Compatibility:

    • Runs native ARM64-compiled apps (e.g., Office ARM build, Edge ARM).

    • x86-32 and x86-64 emulation is available, with roughly 60–80 % of native performance depending on the workload.

    • Many mainstream apps (Adobe Reader, Spotify, Teams) have ARM64 versions or can run under emulation, though specialized professional software (CAD, engineering suites) may not be available natively and suffer performance penalties under emulation.

  • Drivers: Laptop ODMs provide ARM-specific drivers for common hardware (Wi-Fi, Bluetooth, webcam). Legacy peripherals may require USB adapters or may not work if no ARM driver exists.

x86/x64 Ecosystem (Intel i7-13700)

  • Operating Systems: Full support for Windows 10/11, Linux (virtually all modern distributions), BSD variants, and even Windows Server.

  • Application Compatibility: Every x86 and x64 application (from consumer games to enterprise CAD/CAE suites) runs natively without emulation, ensuring maximum compatibility.

  • Drivers: Comprehensive support—for modern hardware down to many years of legacy peripherals, drivers are widely available.

  • Platform Upgradability:

    • Uses LGA 1700 socket, compatible with Intel 600/700-series motherboards.

    • Future upgrades to higher-end Raptor Lake or even next-gen Intel CPUs are feasible on the same motherboard (depending on BIOS updates), protecting your investment.

Takeaway:

  • Intel’s x86 ecosystem remains vastly broader and mature, with no emulation layers and universal software support.

  • Windows on ARM (Snapdragon X Plus) is still developing—many everyday apps are now native, but niche or older professional tools may not run as well or at all.


Pricing and Availability

Qualcomm Snapdragon X Plus

  • Arm-Based Laptops: The first wave of Snapdragon X Plus laptops (e.g., ASUS VivoBook S 15, ProArt PZ13) launched between late 2024 and early 2025, priced from $899 to $1,099 for configurations with 16 GB LPDDR5x and 512 GB NVMe SSD.

  • Midrange models using the 8-core X1P-42-100 variant are expected in the $700–$900 range but may ship with just 8–16 GB LPDDR5x.

  • Windows 11 on ARM license is included by the OEM, so no additional OS cost.

Intel Core i7-13700

  • CPU MSRP: $384–$394.

  • DIY Desktop Build: To build an i7-13700 system, you need a compatible LGA 1700 motherboard (Intel 600/700 series), DDR4/DDR5 memory, a 150 W+ cooler, power supply, and case. A basic build (CPU + motherboard + 16 GB RAM + 512 GB NVMe + midrange air cooler) will start around $800–$900 without a GPU.

  • Prebuilt Desktops: Systems with i7-13700 typically start at $1,000 for a midrange tower (including case, PSU, RAM, storage, and an entry-level discrete GPU or relying on the iGPU).

Takeaway:

  • A Snapdragon X Plus laptop offers a ready-to-go package from about $700 to $1,100, including a high-efficiency ultrathin chassis.

  • A desktop built around an Intel i7-13700 will generally cost $1,000 or more when factoring in all required components (excluding a high-end GPU). The performance density of a desktop platform is higher, but the upfront investment and power requirements are also greater.


Use Cases

Qualcomm Snapdragon X Plus

  1. Ultraportable Laptops

    • Sub-1 kg weight, sub-12 mm thin chassis.

    • Up to 20 hours of battery life on a single charge.

    • Ideal for digital nomads, students, and office workers who need maximum portability and battery endurance.

  2. On-Device AI Workflows

    • The Hexagon NPU can run local inference for lightweight generative models (Llama, Mistral Lite), real-time photo/video filtering, and speech processing without cloud dependency.

    • Well suited for content creators, journalists, and anyone who needs to edit or process media on the go.

  3. Mobile Office & Connectivity

    • Built-in 5G/LTE modems (depending on laptop design), eSIM support, plus Wi-Fi 6E and Bluetooth 5.x.

    • Instant wake-from-sleep and multiple external display support via USB-C or Thunderbolt (varying by OEM implementation).

Intel Core i7-13700

  1. Gaming Desktops

    • Pairing i7-13700 with a midrange or high-end discrete GPU (NVIDIA RTX 30/40 or AMD RX 6000/7000 series) yields excellent performance in AAA titles at 1440p and 4K, including ray tracing and VR.

  2. Workstations & Professional Content Creation

    • Fast compilation of large codebases (C++, Go, Rust, .NET).

    • 4K/8K video editing and rendering in Adobe Premiere Pro, DaVinci Resolve, or Blender with discrete GPU acceleration.

    • 3D modeling and rendering in applications like Autodesk Maya, 3ds Max, or Cinema 4D.

    • Data analysis, virtualization (e.g., Proxmox, VMware ESXi) and light database hosting due to support for ECC memory and numerous PCIe lanes.

  3. Small Office Servers

    • The i7-13700 can handle small-scale database, virtual machine, or CI/CD servers, thanks to its 16 cores and ECC support on compatible motherboards. Its high multi-threaded throughput makes it a cost-effective small server node.


Conclusion

Characteristic Qualcomm Snapdragon X Plus (X1P-64-100) Intel Core i7-13700
CPU Cores/Threads ARM Oryon: 10 cores/10 threads (or 8/8 in lower SKU) 16 cores (8 P + 8 E) / 24 threads
Process Node TSMC N4 (4 nm) Intel 7 (branded “10 nm class,” roughly a 7–8 nm equivalent)
CPU Frequencies Up to 3.40 GHz (Oryon) P-cores: 2.10 GHz (base) → 5.10 GHz (all-core Turbo) Turbo Boost Max 3.0: 5.20 GHz (single-core) E-cores: 1.50 GHz (base) → 4.10 GHz (Turbo)
TDP 23 W (8-core) / 40 W (10-core) 65 W (PL1) / 219 W (PL2)
Cache 30 MB (SoC-level combined) 30 MB Intel Smart Cache (L3) + 24 MB L2
RAM LPDDR5x-8448 MT/s, up to 64 GB, 135 GB/s bandwidth DDR5-5600 (up to 192 GB, 89.6 GB/s) or DDR4-3200 (up to 128 GB, 50 GB/s), ECC optional
Integrated GPU Adreno X1-85 (1.7–3.8 TFLOPS), AV1/H.265 decode/encode UHD 770 (32 EU, ~1.5 TFLOPS), Quick Sync (H.264, HEVC, VP9, AV1)
AI Accelerator Hexagon NPU (45 TOPS) Intel DL Boost (AVX-512/VNNI, ~2–4 TOPS), GNA (dependent on board)
OS & Ecosystem Windows 11 on ARM (x86 emulation, limited niche apps) Windows 10/11, Linux, BSD—native x86/x64 compatibility; broad software and driver support
Price (Device/CPU) Laptops: $700–$1,100 CPU MSRP: $384–$394; DIY build ≥$800–$900; prebuilt desktops start ≈$1,000
  1. Qualcomm Snapdragon X Plus is ideal for users who prioritize extreme portability, silent operation, long battery life, and on-device AI capabilities (Hexagon NPU). It shines in ultralight laptop designs, offering all-day runtime and smooth daily tasks like web browsing, office productivity, and basic photo/video editing.

  2. Intel Core i7-13700 is targeted at users who need maximum performance for demanding workloads: high-fps gaming, professional content creation, 3D rendering, large codebase compilation, and small office-scale server tasks. Its hybrid core design balances single-threaded speed with multi-threaded efficiency—but it requires robust desktop cooling and a higher power budget.

  3. When choosing between these platforms, consider your use case:

    • If you need an ultraportable device with all-day battery life and hardware-accelerated AI features, the Snapdragon X Plus laptop is the more suitable option.

    • If your priority is heavy compute workloads, extensive software compatibility, and upgrade flexibility in a desktop environment, then the i7-13700 desktop platform is the better choice.

Each platform represents the state of the art in its domain: the ARM-based Snapdragon X Plus demonstrates how efficient and capable a modern mobile SoC can be, while Intel’s Raptor Lake i7-13700 showcases the peak of hybrid x86 desktop performance. Whichever meets your specific needs, both are impressive engineering achievements in 2025.

Basic

Label Name
Qualcomm
Intel
Launch Date
April 2024
January 2023
Platform
Laptop
Desktop
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1P-64-100
i7-13700
Code Name
Oryon
Raptor Lake

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
10
24
Performance-cores
10
8
Efficient-cores
-
8
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
5.20 GHz
Performance-core Base Frequency
3.4 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3.4 GHz
-
Intel Hyper-Threading Technology
?
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
-
Yes
Intel Turbo Boost Max Technology 3.0
?
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.
-
Yes
Intel Turbo Boost Technology
?
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
-
2.0
Intel Turbo Boost Max Technology 3.0 Frequency
?
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom. Intel® Turbo Boost Max Technology 3.0 frequency is the clock frequency of the CPU when running in this mode.
-
5.20 GHz
L3 Cache
42MB
30 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
30 MB Intel® Smart Cache
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
FCLGA1700
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
Intel 7
TDP
23-65 W
65 W
Processor Base Power
?
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
-
65 W
Maximum Turbo Power
?
The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.
-
219 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
100°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
5.0 and 4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-
64-bit
Intel 64
?
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
-
Yes
PCI Express Configurations
?
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
-
Up to 1x16+4 | 2x8+4
Max Number of PCI Express Lanes
?
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
-
20

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8448
Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64GB
192 GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
2
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
89.6 GB/s
ECC Memory Supported
?
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
Yes

GPU Specifications

GPU Name
Qualcomm® Adreno™
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
Intel® UHD Graphics 770
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
1.60 GHz
Graphics Base Frequency
?
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
-
300 MHz
DirectX Support
?
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
-
12
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
-
32
Max Resolution (HDMI)
?
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
-
4096 x 2160 @ 60Hz
Max Resolution (DP)
?
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
-
7680 x 4320 @ 60Hz
Max Resolution (eDP - Integrated Flat Panel)
?
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
-
5120 x 3200 @ 120Hz
Number of Displays Supported
-
4
Graphics Performance
3.8 TFLOPS
-
Graphics Output
?
Graphics Output defines the interfaces available to communicate with display devices.
-
eDP 1.4b | DP 1.4a | HDMI 2.1

Miscellaneous

Intel Virtualization Technology for Directed I/O (VT-d)
?
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
-
Yes
Intel Virtualization Technology (VT-x)
?
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
-
Yes
Intel Standard Manageability (ISM)
?
Intel® Standard Manageability is the manageability solution for Intel vPro® Essentials platforms and is a subset of Intel® AMT with out-of-band management over Ethernet and Wi-Fi, but no KVM or new life cycle management features.
-
Intel® SSE4.1 | Intel® SSE4.2 | Intel® AVX2
Enhanced Intel SpeedStep Technology
?
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
-
Yes
Execute Disable Bit
?
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
-
Yes
Intel AES New Instructions
?
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
-
Yes
Intel Active Management Technology (AMT)
-
Yes
Intel Volume Management Device (VMD)
?
Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
-
Yes
Intel Boot Guard
?
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
-
Yes
Intel Hardware Shield Eligibility
-
Yes
Intel Clear Video HD Technology
?
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
-
Yes
Intel VT-x with Extended Page Tables (EPT)
?
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
-
Yes
Intel Control-Flow Enforcement Technology
?
CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.
-
Yes
Intel Deep Learning Boost (Intel DL Boost)
-
Yes
Intel Gaussian Neural Accelerator
?
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
-
3.0
Intel OS Guard
?
Intel OS Guard is a security technology designed to protect operating systems from threats. It is a hardware feature built into Intel processors that helps prevent malicious code from executing in privileged modes of the operating system.
-
Yes
OpenGL Support
?
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
-
4.5
OpenCL Support
?
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
-
3.0
Intel Quick Sync Video
?
Intel Quick Sync Video is a hardware video acceleration technology built into Intel GPUs from Sandy Bridge processors onwards. It allows you to quickly and efficiently perform video-related tasks such as encoding, decoding and converting.
-
Yes

Advantages

Qualcomm Snapdragon X Plus
Snapdragon X Plus
  • Larger L3 Cache: 42MB (42MB vs 30 MB)
  • Higher Technology: 4 nm (4 nm vs Intel 7)
  • Newer Launch Date: April 2024 (April 2024 vs January 2023)
Intel Core i7-13700
Core i7-13700
  • More Total Cores: 16 (10 vs 16)

Geekbench 6

Single Core
Snapdragon X Plus
2346
Core i7-13700
+11% 2593
Multi Core
Snapdragon X Plus
12410
Core i7-13700
+29% 15952

Performance

Snapdragon X Plus
Core i7-13700
287
359.5
MB/Sec
File Compression
+25%
1080
1240
+15%
12
14
Routes/Sec
Navigation
+17%
75.3
112.1
+49%
54.6
51.8
Pages/Sec
HTML5 Browser
+5%
302.2
377.3
+25%
54.9
59.2
MPixels/Sec
PDF Renderer
+8%
332.8
424.4
+28%
32
34.8
Images/Sec
Photo Library
+9%
224
295.1
+32%
13.2
11.9
KLines/Sec
Clang
+11%
98.4
146.2
+49%
175.2
197.6
Pages/Sec
Text Processing
+13%
219.9
264.8
+20%
69.7
78.5
MB/Sec
Asset Compression
+13%
547.1
896.6
+64%
67.7
77.4
Images/Sec
Object Detection
+14%
301.5
263.9
+14%
9.45
13.9
Images/Sec
Background Blur
+47%
52.7
65.1
+24%
72.4
97
MPixels/Sec
Horizon Detection
+34%
475.6
647.1
+36%
198.3
180.7
MPixels/Sec
Object Remover
+10%
1030
1440
+40%
84.6
75.1
MPixels/Sec
HDR
+13%
425.1
468.1
+10%
26
29.5
Images/Sec
Photo Filter
+13%
107.1
123.4
+15%
1990
2360
KPixels/Sec
Ray Tracer
+19%
19600
34400
+76%
77
88
KPixels/Sec
Structure from Motion
+14%
513.9
602.1
+17%
Single Core
Multi Core

Passmark CPU

Single Core
Snapdragon X Plus
3375
Core i7-13700
+23% 4144
Multi Core
Snapdragon X Plus
23650
Core i7-13700
+59% 37659

SiliconCat Rating

55
Ranks 55 among Laptop CPU on our website
230
Ranks 230 among all CPU on our website
52
Ranks 52 among Desktop CPU on our website
104
Ranks 104 among all CPU on our website
Snapdragon X Plus
Core i7-13700

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