Snapdragon X Plus
Qualcomm Snapdragon X Plus vs Intel Core i7-13700HX
CPU Comparison Result
Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon X Plus and Intel Core i7-13700HX processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
Qualcomm
Intel
Launch Date
April 2024
January 2023
Platform
Laptop
Mobile
CPU Architecture
64-bit architecture
-
CPU Name
Qualcomm Oryon CPU
-
Part Number
X1P-64-100
-
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Qualcomm Snapdragon X Plus X1P-64-100
i7-13700HX
Code Name
-
Raptor Lake
CPU Specifications
Boost Frequency
None
-
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
-
24
Performance-cores
-
8
Efficient-cores
-
8
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
5.00 GHz
L3 Cache
-
30 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
42 MB
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
FCBGA1964
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4nm
Intel 7
TDP
-
55 W
Processor Base Power
?
The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.
-
55 W
Maximum Turbo Power
?
The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.
-
157 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
100°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
5.0 and 4.0
Memory Specifications
Memory Bus Width
16-bit x 8 channels
-
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x
Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64 GB
192 GB
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
2
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
-
Maximum Memory Speed
8448 MT/s
-
GPU Specifications
Display Processing Unit
Qualcomm Adreno DPU
-
External Display Standard
DisplayPort 1.4
-
GPU APIs
DirectX 12
-
GPU Name
Qualcomm Adreno GPU
-
GPU Part Number
X1-85
-
Max External Display Resolution
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz
-
Max On-Device Display Resolution
Up to UHD120 HDR10
-
On-Device Display Standard
eDP v1.4b
-
Video Concurrency
4K 60 FPS 8-bit and 10-bit decode + 4K UHD 30 FPS 8-bit encode + 4K UHD 30 FPS 8-bit Miracast
-
Video Decode
4K 60 FPS 10-bit HEVC, VP9, AV1; 4K 60 FPS 8-bit H.264; 4K 120 FPS 8-bit HEVC
-
Video Encode
4K UHD 30 FPS 8-bit HEVC, AV1; 4K UHD 60 FPS 8-bit H.264
-
Video Processing Unit
Qualcomm Adreno VPU
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
Intel® UHD Graphics for 13th Gen Intel® Processors
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1.25 GHz
1.55 GHz
Graphics Performance
3.8 TFLOPS
-
AI Specifications
Micro NPU
Dual Micro NPU on the Qualcomm Sensing Hub
-
NPU Name
Qualcomm Hexagon NPU
-
NPU Performance
45 TOPS
-
Connectivity
Bluetooth Connection Technology
Bluetooth LE
-
Bluetooth Version
Bluetooth 5.4
-
Cellular Bandwidth
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
-
Cellular Modem
Snapdragon X65 5G Modem-RF System
-
Cellular Peak Download Speed
10 Gbps
-
Cellular Peak Upload Speed
3.5 Gbps
-
Wi-Fi Bands
6 GHz, 5 GHz, 2.4 GHz
-
Wi-Fi Standard
Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6; 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
-
Wireless System
Qualcomm FastConnect 7800 Mobile Connectivity System
-
Interfaces and Ports
SD Standard
SD v3.0
-
UFS Version
4.0
-
USB Interface Type
3x USB-C; 3x USB4, 2x USB3.2 Gen2, 1x eUSB2
-
USB Version
USB4
-
Miscellaneous
Always Sensing
Supported
-
Audio Technology
Qualcomm Aqstic Audio technology, Qualcomm aptX Audio
-
Dual Camera Support
2x 36 MP
-
Image Signal Processor
Qualcomm Spectra ISP
-
ISP Bit Width
Dual 18-bit ISPs
-
Single Camera Support
Up to 64 MP
-
Video Capture
4K HDR
-
Advantages
Snapdragon X Plus
- Higher Technology: 4nm (4nm vs Intel 7)
- Newer Launch Date: April 2024 (April 2024 vs January 2023)
Core i7-13700HX
- More Total Cores: 16 (10 vs 16)
Geekbench 6
Single Core
Snapdragon X Plus
+4%
2346
Core i7-13700HX
2261
Multi Core
Snapdragon X Plus
+21%
12410
Core i7-13700HX
10292
Performance
Core i7-13700HX
Single Core
Multi Core
Passmark CPU
Single Core
Snapdragon X Plus
3375
Core i7-13700HX
+15%
3881
Multi Core
Snapdragon X Plus
23650
Core i7-13700HX
+44%
34021
SiliconCat Rating
87
Ranks 87 among Laptop CPU on our website
319
Ranks 319 among all CPU on our website
144
Ranks 144 among Mobile CPU on our website
473
Ranks 473 among all CPU on our website
Snapdragon X Plus
Core i7-13700HX
