HiSilicon Kirin 8000 vs MediaTek Dimensity 9600 Pro

HiSilicon
Kirin 8000
vs
Specifications of SoCs

SoC Comparison Result

Below are the results of a comparison of the characteristics and performance of the HiSilicon Kirin 8000 and MediaTek Dimensity 9600 Pro mobile processors. This comparison will help you determine which one best suits your needs.

Basic

Label Name
HiSilicon
MediaTek
Launch Date
October 2024
September 2026
Platform
SmartPhone Mid range
SmartPhone Flagship
System Level Cache (SLC)
-
10 MB
Manufacturing
SMIC
TSMC
Model Name
Kirin 8000
MT6995
Architecture
1x 2.4 GHz – 1xA77 H
3x 2.19 GHz – 1xA77 L
4x 1.84 GHz – A55
2x 4.55 GHz Arm C2-Ultra + 3x 4.35 GHz Arm C2-Pro + 3x 3.10 GHz Arm C2-Pro
Cores
8
8
Technology
7 nm
2 nm
Frequency
2400 MHz
4.55 GHz
Instruction set
ARMv8.2-A
Armv9.3-A

GPU Specifications

GPU name
Mali-G610 MP4
Arm Mali-G2 Ultra NX
GPU frequency
864 MHz
-
Max display resolution
-
WQHD+
FLOPS
0.4423 TFLOPS
-
Shading units
128
-
OpenCL version
2.0
-
Vulkan version
1.3
-

Connectivity

Cellular specific functions
-
5G/4G Triple SIM Triple Active, Dual Data, SA and NSA, SA Option 2, NSA Option 3/3a/3x, NR FR1 TDD+FDD, DSS, 256QAM, VoNR, EPS fallback
Cellular technologies
-
3GPP Release 17, Sub-6GHz (FR1), 2G-5G multi-mode, 5G-CA, 4G-CA, 5G FDD/TDD, 4G FDD/TDD, TD-SCDMA, WCDMA, EDGE, GSM
Downlink functions
-
Sub-6 DL 5CC 350 MHz, Release 17 Enhancement, low-band DL 4x4 MIMO
Download speed
-
>7.4 Gbps
Modem power saving technologies
-
MediaTek 5G UltraSave 2.0, Release 17 Power Saving Enhancement
Uplink functions
-
Sub-6 UL 2CC 200 MHz, Release 17 Enhancement, FDD UL 2x2 MIMO, PC2
4G support
-
Yes
5G support
Yes
Yes, 5G-Advanced
Bluetooth
5.2
Bluetooth 6.2, dual Bluetooth engine, up to 12 Mbps
Wi-Fi
6
Wi-Fi 7 (802.11a/b/g/n/ac/ax/be), Triple Band Triple Concurrency, up to 7.3 Gbps
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
GPS, BeiDou, GLONASS, Galileo, QZSS, NavIC

Memory Specifications

Memory type
LPDDR5
LPDDR6 / LPDDR5X
Memory frequency
3200 MHz
10667 MT/s
Memory Bus
4x 16 Bit
-

Miscellaneous

L2 Cache
-
8.5 MB (2x 2 MB + 3x 1 MB + 3x 512 KB)
L3 cache
-
16 MB
Audio codecs
- AAC
- AIFF
- CAF
- MP3
- MP4
- WAV
-
Max camera resolution
-
200 MP
Storage type
UFS 2.2, UFS 3.1
UFS 5.0
Video codecs
- H.264
- H.265
- VP9
VVC (H.266), HEVC (H.265), AVC (H.264), VP9, AV1, MV-HEVC
Video playback
4K at 30FPS, 1080p at 60FPS
8K at 60 FPS, 10-bit
Video capture
4K at 30FPS, 1K at 60FPS
8K at 60 FPS; 4K at 120 FPS with EIS; 4K at 240 FPS slow-motion; 4K at 60 FPS HDR
Display refresh rate
-
180 Hz
AI features
-
Native AI Architecture, Dimensity Agentic AI Engine, AI Compute Fusion, Neural Graphics Architecture, AI Imaging Fusion Architecture, on-device MoE inference, edge-training LLM, KV-cache compression
Neural processor (NPU)
Yes
MediaTek NPU 1090 + Super Efficient NPU 2.0

Advantages

HiSilicon Kirin 8000
Kirin 8000
  • Higher Frequency: 2400 MHz (2400 MHz vs 4.55 GHz)
MediaTek Dimensity 9600 Pro
Dimensity 9600 Pro
  • Higher Technology: 2 nm (7 nm vs 2 nm)
  • Newer Launch Date: September 2026 (October 2024 vs September 2026)

Geekbench 6

Single Core
Kirin 8000
989
Dimensity 9600 Pro
+339% 4346
Multi Core
Kirin 8000
2919
Dimensity 9600 Pro
+347% 13052

AntuTu 11

Kirin 8000
808658
Dimensity 9600 Pro
+498% 4838033

SiliconCat Rating

117
Ranks 117 among all SOC on our website
3
Ranks 3 among all SOC on our website
Kirin 8000
Dimensity 9600 Pro

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