Qualcomm Snapdragon 870 vs MediaTek Dimensity 7500

Qualcomm
Snapdragon 870
vs
MediaTek
Dimensity 7500
Specifications of SoCs

SoC Comparison Result

Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon 870 and MediaTek Dimensity 7500 mobile processors. This comparison will help you determine which one best suits your needs.

Basic

Label Name
Qualcomm
MediaTek
Launch Date
January 2021
May 2026
Platform
SmartPhone Flagship
SmartPhone Mid range
Manufacturing
TSMC
-
Model Name
SM8250-AC
MediaTek Dimensity 7500
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
4x Arm C1 Pro @ 2.6GHz + 4x Arm C1 Nano @ 2.0GHz
Cores
8
Octa (8)
Technology
7 nm
4 nm
Frequency
3200 MHz
Up to 2.6GHz
Transistor count
10.3
-
Instruction set
ARMv8.2-A
Armv9.3-A

GPU Specifications

GPU name
Adreno 650
Arm Mali-G625 MC2
GPU frequency
670 MHz
-
Max display resolution
3840 x 2160
Primary up to 1344 x 2800; secondary up to 1300 x 1200
FLOPS
1.3721 TFLOPS
-
Execution units
2
-
Shading units
512
-
OpenCL version
2.0
-
Vulkan version
1.1
-
DirectX version
12.1
-

Connectivity

Cellular specific functions
-
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 220MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2x2 MIMO, 256QAM VoNR / EPS fallback, Smart Network Suite 3.0
Cellular technologies
-
2G-5G multi-mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA
Downlink functions
-
NR DL 3CC 220MHz bandwidth, 4x4 MIMO
Download speed
Up to 7500 Mbps
5.2Gbps
Modem power saving technologies
-
MediaTek 5G UltraSave 3.0+
Uplink functions
-
256QAM NR UL 2CC, R16 UL Enhancement, 2x2 MIMO
Wi-Fi antenna
-
Up to 2T2R
4G support
LTE Cat. 22
4G FDD / TDD, 4G-CA
5G support
Yes
5G FDD / TDD, SA / NSA, 5G-CA
Bluetooth
5.2
Bluetooth 5.4, Bluetooth Hybrid Coexistence, Bluetooth Long Range, Xtra Range 3.0
Wi-Fi
6
Wi-Fi 6E (a/b/g/n/ac/ax)
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
GPS, BeiDou, Glonass, Galileo, QZSS, NavIC

Memory Specifications

Memory type
LPDDR5
LPDDR5
Memory frequency
2750 MHz
Up to 6400Mbps
Memory Bus
4x 16 Bit
-

Miscellaneous

L2 Cache
1 MB
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP, 2x 25MP
200MP
Storage type
UFS 3.0, UFS 3.1
UFS 3.1 2-lane
Video codecs
H.264, H.265, VP8, VP9
Encode: H.264, HEVC; Decode: H.264, HEVC, VP-9
Video playback
8K at 30FPS, 4K at 60FPS
4K HDR
Video capture
8K at 30FPS, 4K at 60FPS
4K30 (3840 x 2160) - 10 bit
Display refresh rate
-
Primary up to 144Hz; secondary up to 120Hz
Dual display support
-
Secondary display up to 1300 x 1200 @ 120Hz
AI features
-
Generative AI support, global AI ecosystem support, on-device speech recognition, speech-to-text, text-to-speech, contextual replies, notification summarization
Neural processor (NPU)
Hexagon 698
MediaTek NPU 850
TDP
6 W
-

Advantages

Qualcomm Snapdragon 870
Snapdragon 870
  • Higher Frequency: 3200 MHz (3200 MHz vs Up to 2.6GHz)
MediaTek Dimensity 7500
Dimensity 7500
  • Higher Technology: 4 nm (7 nm vs 4 nm)
  • Newer Launch Date: May 2026 (January 2021 vs May 2026)

Geekbench 6

Single Core
Snapdragon 870
1151
Dimensity 7500
+8% 1243
Multi Core
Snapdragon 870
3336
Dimensity 7500
+7% 3569

SiliconCat Rating

89
Ranks 89 among all SOC on our website
78
Ranks 78 among all SOC on our website
Snapdragon 870
Dimensity 7500

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