MediaTek Dimensity 8250
MediaTek Dimensity 8250 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2024. The SoC has Octa (8) cores produced using 4 nm technology. And it also has a maximum frequency of Up to 3.1 GHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Basic
Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2024
Model Name
Dimensity 8250
Architecture
1× Cortex-A78 @ 3.1 GHz + 3× Cortex-A78 @ 3.0 GHz + 4× Cortex-A55 @ 2.0 GHz
Cores
Octa (8)
Technology
4 nm
Frequency
Up to 3.1 GHz
Instruction set
ARMv8.2-A (64-bit)
GPU Specifications
GPU name
Arm Mali-G610 MC6
Max display resolution
WQHD+ @ 120 Hz (FHD+ @ 180 Hz)
Connectivity
4G support
LTE (FDD/TDD), 4G CA
5G support
5G Sub-6; 3GPP Rel-16; 3CC CA; SA/NSA; DL up to 4.7 Gbps
Bluetooth
Bluetooth 5.3 (LE Audio Dual-Link TWS)
Wi-Fi
Wi-Fi 6E (802.11 a/b/g/n/ac/ax), 2×2 (2T2R)
Navigation
GPS L1CA+L5; BeiDou B1I/B2a/B1C; GLONASS L1OF; Galileo E1/E5a; QZSS L1CA/L5; NavIC
Memory Specifications
Memory type
LPDDR5 (quad-channel)
Memory frequency
Up to 6400 Mbps
Miscellaneous
L3 cache
4 MB
Max camera resolution
Up to 320 MP; triple 32+32+32 MP
Storage type
UFS 3.1
Video codecs
H.264, HEVC (encode/decode); VP9, AV1 (decode)
Video playback
H.264, HEVC, VP9, AV1 playback
Video capture
4K (3840 × 2160)
Neural processor (NPU)
MediaTek NPU 580 (multi-core)
