Snapdragon X Elite X1E-00-1DE
Qualcomm Snapdragon X Elite X1E-00-1DE vs AMD Ryzen 7 5700X3D
CPU Comparison Result
Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon X Elite X1E-00-1DE and AMD Ryzen 7 5700X3D processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
Qualcomm
AMD
Launch Date
October 2023
January 2024
Platform
Laptop
Desktop
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
X1E-00-1DE
Ryzen 7 5700X3D
Code Name
Oryon
Vermeer
Foundry
Samsung TSMC
-
Generation
Oryon
Ryzen 7 (Zen 3 (Vermeer))
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
12
16
Performance-cores
12
-
Basic Frequency
-
3 GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
up to 4.1 GHz
Performance-core Base Frequency
3.8 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.3 GHz
-
L1 Cache
-
64 KB (per core)
L2 Cache
-
512 KB (per core)
L3 Cache
42MB
96 MB (shared)
Multiplier Unlocked
-
No
Multiplier
-
30.0x
Bus Frequency
-
100 MHz
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
AMD Socket AM4
Unlocked Multiplier
No
-
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
7 nm
TDP
23-65 W
105 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
-
90°C
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
-
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
Gen 4, 20 Lanes (CPU only)
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
Arm-64
-
Transistors
-
8,850 million
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8448
DDR4
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
64GB
-
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Dual-channel
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
135 GB/s
-
ECC Memory
-
Yes
GPU Specifications
GPU Name
Qualcomm® Adreno™
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
True
N/A
Graphics Performance
4.6 TFLOPS
-
Advantages
Snapdragon X Elite X1E-00-1DE
- More Total Cores: 12 (12 vs 8)
- Higher Technology: 4 nm (4 nm vs 7 nm)
- Higher Memory Type: LPDDR5x-8448 (LPDDR5x-8448 vs DDR4)
Ryzen 7 5700X3D
- Larger L3 Cache: 96 MB (shared) (42MB vs 96 MB (shared))
- Newer Launch Date: January 2024 (October 2023 vs January 2024)
Geekbench 6
Single Core
Snapdragon X Elite X1E-00-1DE
+41%
2742
Ryzen 7 5700X3D
1938
Multi Core
Snapdragon X Elite X1E-00-1DE
+57%
15381
Ryzen 7 5700X3D
9812
Performance
Ryzen 7 5700X3D
Single Core
Multi Core
Passmark CPU
Single Core
Snapdragon X Elite X1E-00-1DE
+12%
3346
Ryzen 7 5700X3D
2986
Multi Core
Snapdragon X Elite X1E-00-1DE
22749
Ryzen 7 5700X3D
+16%
26429
SiliconCat Rating
12
Ranks 12 among Laptop CPU on our website
105
Ranks 105 among all CPU on our website
126
Ranks 126 among Desktop CPU on our website
354
Ranks 354 among all CPU on our website
Snapdragon X Elite X1E-00-1DE
Ryzen 7 5700X3D
