Dimensity 8100
MediaTek Dimensity 8100 vs HiSilicon Kirin 9010
SoC Comparison Result
Below are the results of a comparison of the characteristics and performance of the MediaTek Dimensity 8100 and HiSilicon Kirin 9010 mobile processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
MediaTek
HiSilicon
Launch Date
March 2022
April 2024
Platform
SmartPhone Flagship
SmartPhone Flagship
Manufacturing
TSMC
SMIC
Model Name
MT6895Z/TCZA
Kirin 9010
Architecture
4x 2.85 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Cores
8
12
Technology
5 nm
7 nm
Frequency
2850 MHz
2300 MHz
Instruction set
ARMv8.2-A
-
GPU Specifications
GPU name
Mali-G610 MP6
Maleoon 910
GPU frequency
860 MHz
750 MHz
Max display resolution
2960 x 1440
-
FLOPS
1.309 TFLOPS
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
-
DirectX version
12
-
Connectivity
4G support
LTE Cat. 21
-
5G support
Yes
-
Bluetooth
5.3
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
-
Memory Specifications
Memory type
LPDDR5
-
Memory frequency
3200 MHz
2750 MHz
Memory Bus
4x 16 Bit
4x 16 Bit
Max Bandwidth
51.2 Gbit/s
44 Gbit/s
Miscellaneous
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 200MP
-
Storage type
UFS 3.1
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
Video capture
4K at 60FPS
-
Neural processor (NPU)
Yes
-
TDP
6 W
-
Advantages
Dimensity 8100
- Higher Technology: 5 nm (5 nm vs 7 nm)
- Higher Frequency: 2850 MHz (2850 MHz vs 2300 MHz)
- Higher Max Bandwidth: 51.2 Gbit/s (51.2 Gbit/s vs 44 Gbit/s)
Kirin 9010
- Newer Launch Date: April 2024 (March 2022 vs April 2024)
Geekbench 6
Single Core
Dimensity 8100
1141
Kirin 9010
+24%
1413
Multi Core
Dimensity 8100
3640
Kirin 9010
+25%
4560
AnTuTu 10
Dimensity 8100
852364
Kirin 9010
+11%
950322
SiliconCat Rating
50
Ranks 50 among all SOC on our website
33
Ranks 33 among all SOC on our website
Kirin 9010
