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MediaTek Dimensity 8100

MediaTek Dimensity 8100

MediaTek Dimensity 8100 is a SmartPhone Flagship platform from MediaTek. It began to be released in March 2022. The SoC has 8 cores produced using 5 nm technology. And it also has a maximum frequency of 2850 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 47

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
March 2022
Manufacturing
TSMC
Model Name
MT6895Z/TCZA
Architecture
4x 2.85 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Cores
8
Technology
5 nm
Frequency
2850 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G610 MP6
GPU frequency
860 MHz
Max display resolution
2960 x 1440
FLOPS
1.309 TFLOPS
Execution units
6
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Yes
TDP
6 W

Geekbench 6

Single Core
1141
Multi Core
3640

AnTuTu 10

852364

FP32 (float)

1322

Compared to Other SoC

43%
53%
79%
Better then 43% SOC over the past year
Better then 53% SOC over the past 3 years
Better then 79% SOC

SiliconCat Rating

47
Ranks 47 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 870
Qualcomm, January 2021
1151
Dimensity 8100
MediaTek, March 2022
1141
Helio G70
MediaTek, January 2020
418
Kirin 658
HiSilicon, March 2017
206
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8100
MediaTek, March 2022
3640
Snapdragon 4 Gen 2
Qualcomm, June 2023
2128
Helio G88
MediaTek, June 2021
1357
Snapdragon 439
Qualcomm, June 2018
799
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9000S
HiSilicon, August 2023
932745
Dimensity 8100
MediaTek, March 2022
852364
Snapdragon 750G
Qualcomm, September 2020
455096
Snapdragon 480 Plus
Qualcomm, October 2021
353126
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
A16 Bionic
Apple, September 2022
1770
Dimensity 8100
MediaTek, March 2022
1322
Kirin 980
HiSilicon, August 2018
523
Snapdragon 4 Gen 2
Qualcomm, June 2023
355

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