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MediaTek Dimensity 8100

MediaTek Dimensity 8100

MediaTek Dimensity 8100 is a SmartPhone Flagship platform from MediaTek. It began to be released in March 2022. The SoC has 8 cores produced using 5 nm technology. And it also has a maximum frequency of 2850 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 43

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
March 2022
Manufacturing
TSMC
Model Name
MT6895Z/TCZA
Architecture
4x 2.85 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Cores
8
Technology
5 nm
Frequency
2850 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G610 MP6
GPU frequency
860 MHz
Max display resolution
2960 x 1440
FLOPS
1.309 TFLOPS
Execution units
6
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Yes
TDP
6 W

Geekbench 6

Single Core
1141
Multi Core
3640

AnTuTu 10

852364

FP32 (float)

1322

Compared to Other SoC

32%
55%
80%
Better then 32% SOC over the past year
Better then 55% SOC over the past 3 years
Better then 80% SOC

SiliconCat Rating

43
Ranks 43 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 8100
MediaTek, March 2022
1141
Dimensity 810
MediaTek, August 2021
787
Snapdragon 821
Qualcomm, August 2016
391
Snapdragon 625
Qualcomm, February 2016
189
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8100
MediaTek, March 2022
3640
Dimensity 6100 Plus
MediaTek, July 2023
1965
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Dimensity 8100
MediaTek, March 2022
852364
Kirin 980
HiSilicon, August 2018
589127
Snapdragon 4 Gen 2
Qualcomm, June 2023
423776
Snapdragon 680
Qualcomm, October 2021
319423
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
A15 Bionic
Apple, September 2021
1661
Dimensity 8100
MediaTek, March 2022
1322
Snapdragon 690
Qualcomm, June 2020
501
Dimensity 800
MediaTek, December 2019
342

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