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MediaTek Dimensity 6300

MediaTek Dimensity 6300

MediaTek Dimensity 6300 is a new budget 8-core mobile processor announced in April 2024 and manufactured on 6nm process technology. Key features of this chip: CPU performance: Dimensity 6300 has 2 high-performance Cortex-A76 cores with clock speeds up to 2.4 GHz and 6 energy-efficient Cortex-A55 cores at 2 GHz. According to MediaTek, this provides a 10% increase in CPU performance compared to the previous Dimensity 6100+. It scores 461,135 in the AnTuTu benchmark and 829 in single-core and 2,178 in multi-core in Geekbench 6. GPU: Dimensity 6300 uses a Mali-G57 MP2 GPU with 64 shader units and support for Vulkan 1.3 and OpenCL 2.0. This should provide acceptable gaming performance for the budget segment. Energy efficiency: The chipset supports UltraSave 3.0+ technology to save battery power. Camera and display support: The Dimensity 6300 can handle up to 108MP main cameras and displays up to 2520 x 1080 pixels with a 120Hz refresh rate for a smooth experience. Connection: The processor supports 5G (up to 3.3 Gbps), Wi-Fi 5, Bluetooth 5.2, GPS and other navigation systems. First devices: One of the first smartphones based on Dimensity 6300 was the budget Realme C65 5G, also equipped with a 6.67" 120 Hz display, a 50 MP main camera and a 5000 mAh battery. Thus, the Dimensity 6300 looks like a decent processor for inexpensive 5G smartphones with good performance, support for modern cameras and screens, and energy efficiency.

New this year
Top SOC: 105

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
April 2024
Manufacturing
TSMC
Model Name
Dimensity 6300
Architecture
2x 2.4 GHz – Cortex-A76, 6x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2400 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G57 MC2
Max display resolution
2520 x 1080 Up to 120Hz

Connectivity

4G support
Yes
5G support
Yes
Bluetooth
5.2
Wi-Fi
Wi-Fi 5 (a/b/g/n/ac)
Navigation
GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC

Memory Specifications

Memory type
LPDDR4x
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit
Max Bandwidth
17.07 Gbit/s

Miscellaneous

Max camera resolution
Native 108MP 16MP + 16MP

Geekbench 6

Single Core
829
Multi Core
2178

AnTuTu 10

461135

Compared to Other SoC

16%
18%
54%
Better then 16% SOC over the past year
Better then 18% SOC over the past 3 years
Better then 54% SOC

SiliconCat Rating

105
Ranks 105 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9400
MediaTek, November 2024
2832
Dimensity 8100
MediaTek, March 2022
1141
Dimensity 6300
MediaTek, April 2024
829
Helio G80
MediaTek, February 2020
417
Helio G37
MediaTek, June 2020
206
Geekbench 6 Multi Core
Dimensity 9400
MediaTek, November 2024
11974
Dimensity 1100
MediaTek, January 2021
3332
Dimensity 6300
MediaTek, April 2024
2178
Kirin 960
HiSilicon, October 2016
1385
Helio G35
MediaTek, June 2020
813
AnTuTu 10
Kirin 9000
HiSilicon, October 2020
935199
A12 Bionic
Apple, September 2018
624370
Dimensity 6300
MediaTek, April 2024
461135
Snapdragon 730
Qualcomm, April 2019
363680
Kirin 710F
HiSilicon, January 2019
249186

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