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HiSilicon Kirin 659

HiSilicon Kirin 659

HiSilicon Kirin 659 is a SmartPhone Mid range platform from HiSilicon. It began to be released in January 2017. The SoC has 8 cores produced using 16 nm technology. And it also has a maximum frequency of 2360 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 199

Basic

Label Name
HiSilicon
Platform
SmartPhone Mid range
Launch Date
January 2017
Model Name
Hi6250
Architecture
4x 2.36 GHz – Cortex-A53 4x 1.7 GHz – Cortex-A53
Cores
8
Technology
16 nm
Frequency
2360 MHz
Transistor count
4
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-T830 MP2
GPU frequency
900 MHz
Max display resolution
1920 x 1200
FLOPS
0.0576 TFLOPS
Execution units
2
Shading units
16
OpenCL version
1.2
Vulkan version
1.0
DirectX version
11

Connectivity

4G support
LTE Cat. 7
5G support
No
Bluetooth
4.2
Wi-Fi
4
Navigation
GPS, GLONASS, Beidou

Memory Specifications

Memory type
LPDDR3
Memory frequency
933 MHz
Memory Bus
2x 32 Bit

Miscellaneous

Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 16MP, 2x 8MP
Storage type
eMMC 5.1
Video codecs
H.264, H.265
Video playback
1080p at 60FPS
Video capture
1K at 60FPS
Neural processor (NPU)
No

Geekbench 6

Single Core
215
Multi Core
810

AnTuTu 10

102892

FP32 (float)

59

Compared to Other SoC

0%
0%
10%
Better then 0% SOC over the past year
Better then 0% SOC over the past 3 years
Better then 10% SOC

SiliconCat Rating

199
Ranks 199 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9200
MediaTek, November 2022
1949
Exynos 1380
Samsung, February 2023
1008
Dimensity 6020
MediaTek, March 2023
732
Snapdragon 660
Qualcomm, May 2017
345
Kirin 659
HiSilicon, January 2017
215
Geekbench 6 Multi Core
Dimensity 8300
MediaTek, November 2023
4844
Snapdragon 778G
Qualcomm, May 2021
2787
Helio G90T
MediaTek, July 2019
1850
Helio X30
MediaTek, February 2017
1115
Kirin 659
HiSilicon, January 2017
810
AnTuTu 10
Snapdragon 6 Gen 1
Qualcomm, September 2022
588454
Dimensity 6080
MediaTek, June 2023
435944
Snapdragon 835
Qualcomm, November 2016
342710
Snapdragon 665
Qualcomm, April 2019
233204
Kirin 659
HiSilicon, January 2017
102892
FP32 (float)
Dimensity 800U
MediaTek, August 2020
336
Kirin 810
HiSilicon, June 2019
239
Kirin 950
HiSilicon, November 2015
118
Exynos 7885
Samsung, February 2018
70
Kirin 659
HiSilicon, January 2017
59