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MediaTek Dimensity 8020

MediaTek Dimensity 8020

MediaTek Dimensity 8020 is a SmartPhone Mid range platform from MediaTek. It began to be released in April 2023. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 2600 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 51

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
April 2023
Manufacturing
TSMC
Model Name
Dimensity 8020
Architecture
4x 2.6 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2600 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G77 MP9
GPU frequency
850 MHz
Max display resolution
2520 x 1080
FLOPS
0.9792 TFLOPS
Execution units
9
Shading units
64
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
34.1 Gbit/s

Miscellaneous

L2 Cache
320 KB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 108MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 570
TDP
4 W

Geekbench 6

Single Core
1124
Multi Core
3709

AnTuTu 10

735979

Compared to Other SoC

44%
52%
77%
Better then 44% SOC over the past year
Better then 52% SOC over the past 3 years
Better then 77% SOC

SiliconCat Rating

51
Ranks 51 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 7s Gen 3
Qualcomm, August 2024
1185
Dimensity 8020
MediaTek, April 2023
1124
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8020
MediaTek, April 2023
3709
A10X Fusion
Apple, June 2017
2201
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 8020
MediaTek, April 2023
735979
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691

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