Top 100

MediaTek Dimensity 7200 Ultra

MediaTek Dimensity 7200 Ultra

MediaTek Dimensity 7200 Ultra is a SmartPhone Mid range platform from MediaTek. It began to be released in September 2023. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 2800 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 70

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
September 2023
Manufacturing
TSMC
Model Name
Dimensity 7200 Ultra
Architecture
2x 2.8 GHz – Cortex-A7156x 2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
2800 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G610 MC4
Max display resolution
2520 x 1080
Execution units
4
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
MediaTek APU 650
TDP
5 W

Geekbench 6

Single Core
1125
Multi Core
2705

AnTuTu 10

783754

Compared to Other SoC

35%
41%
69%
Better then 35% SOC over the past year
Better then 41% SOC over the past 3 years
Better then 69% SOC

SiliconCat Rating

70
Ranks 70 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 7s Gen 3
Qualcomm, August 2024
1185
Dimensity 7200 Ultra
MediaTek, September 2023
1125
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Exynos 2100
Samsung, December 2020
3334
Dimensity 7200 Ultra
MediaTek, September 2023
2705
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 7200 Ultra
MediaTek, September 2023
783754
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691

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