Top 100

MediaTek Dimensity 7200 Ultra

MediaTek Dimensity 7200 Ultra

MediaTek Dimensity 7200 Ultra is a SmartPhone Mid range platform from MediaTek. It began to be released in September 2023. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 2800 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 66

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
September 2023
Manufacturing
TSMC
Model Name
Dimensity 7200 Ultra
Architecture
2x 2.8 GHz – Cortex-A7156x 2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
2800 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G610 MC4
Max display resolution
2520 x 1080
Execution units
4
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
MediaTek APU 650
TDP
5 W

Geekbench 6

Single Core
1125
Multi Core
2705

AnTuTu 10

783754

Compared to Other SoC

33%
41%
70%
Better then 33% SOC over the past year
Better then 41% SOC over the past 3 years
Better then 70% SOC

SiliconCat Rating

66
Ranks 66 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 870
Qualcomm, January 2021
1151
Dimensity 7200 Ultra
MediaTek, September 2023
1125
Helio G70
MediaTek, January 2020
418
Kirin 658
HiSilicon, March 2017
206
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Snapdragon 865
Qualcomm, December 2019
3277
Dimensity 7200 Ultra
MediaTek, September 2023
2705
Helio G88
MediaTek, June 2021
1357
Snapdragon 439
Qualcomm, June 2018
799
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9000S
HiSilicon, August 2023
932745
Dimensity 7200 Ultra
MediaTek, September 2023
783754
Snapdragon 750G
Qualcomm, September 2020
455096
Snapdragon 480 Plus
Qualcomm, October 2021
353126

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