Top 500

HiSilicon Kirin 710

HiSilicon Kirin 710

HiSilicon Kirin 710 is a SmartPhone Mid range platform from HiSilicon. It began to be released in July 2018. The SoC has 8 cores produced using 12 nm technology. And it also has a maximum frequency of 2200 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 167

Basic

Label Name
HiSilicon
Platform
SmartPhone Mid range
Launch Date
July 2018
Manufacturing
TSMC
Model Name
Hi6260
Architecture
4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53
Cores
8
Technology
12 nm
Frequency
2200 MHz
Transistor count
5.5
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G51 MP4
GPU frequency
1000 MHz
Max display resolution
2340 x 1080
FLOPS
0.128 TFLOPS
Execution units
4
Shading units
16
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 12
5G support
No
Bluetooth
4.2
Wi-Fi
4
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR4X
Memory frequency
1866 MHz
Memory Bus
2x 32 Bit

Miscellaneous

L2 Cache
512 KB
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 40MP, 2x 24MP
Storage type
eMMC 5.1, UFS 2.1
Video codecs
H.264, H.265, VP8, VP9
Video playback
1080p at 60FPS
Video capture
1K at 30FPS
Neural processor (NPU)
No
TDP
5 W

Geekbench 6

Single Core
356
Multi Core
1197

AnTuTu 10

196033

FP32 (float)

130

Compared to Other SoC

0%
1%
25%
Better then 0% SOC over the past year
Better then 1% SOC over the past 3 years
Better then 25% SOC

SiliconCat Rating

167
Ranks 167 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9200
MediaTek, November 2022
1949
Exynos 1380
Samsung, February 2023
1008
Dimensity 6020
MediaTek, March 2023
732
Kirin 710
HiSilicon, July 2018
356
MT6750
MediaTek, August 2016
138
Geekbench 6 Multi Core
Dimensity 8300
MediaTek, November 2023
4844
Snapdragon 778G
Qualcomm, May 2021
2787
Helio G90T
MediaTek, July 2019
1850
Kirin 710
HiSilicon, July 2018
1197
MT6750
MediaTek, August 2016
402
AnTuTu 10
Snapdragon 6 Gen 1
Qualcomm, September 2022
588454
Dimensity 6080
MediaTek, June 2023
435944
Snapdragon 835
Qualcomm, November 2016
342710
Snapdragon 665
Qualcomm, April 2019
233204
Kirin 710
HiSilicon, July 2018
196033
FP32 (float)
Snapdragon 730
Qualcomm, April 2019
347
Exynos 8890
Samsung, November 2015
246
Kirin 710
HiSilicon, July 2018
130
T606
Unisoc, September 2021
80
MT6750
MediaTek, August 2016
32