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MediaTek Dimensity 8400

MediaTek Dimensity 8400
MediaTek Dimensity 8400 is a SmartPhone Flagship platform from MediaTek. It began to be released in December 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3250 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 21

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
December 2024
Manufacturing
TSMC
Model Name
Dimensity 8400
Architecture
1x 3.25 GHz – Cortex-A725 3x 3.0 GHz – Cortex-A725 4x 2.1 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3250 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G720 MC7
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
8533 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
136 Gbit/s

Miscellaneous

L2 Cache
3.5 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

Geekbench 6

Single Core
1668
Multi Core
6901

Compared to Other SoC

67%
77%
91%
Better then 67% SOC over the past year
Better then 77% SOC over the past 3 years
Better then 91% SOC

SiliconCat Rating

21
Ranks 21 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 8400
MediaTek, December 2024
1668
Exynos 980
Samsung, September 2019
869
Tiger T615
Unisoc, August 2024
445
Helio P22
MediaTek, May 2018
234
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8400
MediaTek, December 2024
6901
Dimensity 800
MediaTek, December 2019
2276
Snapdragon 712
Qualcomm, February 2019
1441
Snapdragon 430
Qualcomm, September 2015
832