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MediaTek Dimensity 8400

MediaTek Dimensity 8400
MediaTek Dimensity 8400 is a SmartPhone Flagship platform from MediaTek. It began to be released in December 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3250 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Top SOC: 44

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
December 2024
Manufacturing
TSMC
Model Name
Dimensity 8400
Architecture
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3250 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G720 MC7
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

Download speed
Up to 7900 Mbps
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
8533 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L2 Cache
3.5 MB
L3 cache
6 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

AnTuTu 10

Score
1772345

Performance

CPU
Score
396653
GPU
Score
666095
Memory
Score
365728
UX
Score
343869
Show more

Geekbench 6

Single Core
1668
Multi Core
6901

AntuTu 11

1948428

Compared to Other SoC

63%
63%
85%
Better then 63% SOC over the past year
Better then 63% SOC over the past 3 years
Better then 85% SOC

SiliconCat Rating

44
Ranks 44 among all SOC on our website
Geekbench 6 Single Core
A20 Pro
Apple, September 2026
4713
Dimensity 8400
MediaTek, December 2024
1668
Dimensity 7450X
MediaTek, April 2026
1108
Exynos 1330
Samsung, February 2023
879
Tiger T620
Unisoc, August 2024
502
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 8400
MediaTek, December 2024
6901
Dimensity 1000 Plus
MediaTek, May 2020
3152
Dimensity 900
MediaTek, May 2021
2240
Snapdragon 835
Qualcomm, November 2016
1519
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Dimensity 8400
MediaTek, December 2024
1772345
Dimensity 8200
MediaTek, December 2022
938571
Dimensity 7300
MediaTek, May 2024
686609
T7300
Unisoc, July 2025
510000
AntuTu 11
Exynos 2400e
Samsung, September 2024
1977269
A18
Apple, September 2024
1972476
Dimensity 8400
MediaTek, December 2024
1948428
Tensor G6
Google, August 2026
1933536
Kirin 9050 Pro
HiSilicon, September 2026
1902468