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MediaTek Dimensity 8400

MediaTek Dimensity 8400
MediaTek Dimensity 8400 is a SmartPhone Flagship platform from MediaTek. It began to be released in December 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3250 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Top SOC: 37

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
December 2024
Manufacturing
TSMC
Model Name
Dimensity 8400
Architecture
1x 3.25 GHz – Cortex-A725
3x 3.0 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3250 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G720 MC7
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

Download speed
Up to 7900 Mbps
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
8533 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L2 Cache
3.5 MB
L3 cache
6 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

AnTuTu 10

Score
1772345

Performance

CPU
Score
396653
GPU
Score
666095
Memory
Score
365728
UX
Score
343869
Show more

Geekbench 6

Single Core
1668
Multi Core
6901

Compared to Other SoC

66%
66%
87%
Better then 66% SOC over the past year
Better then 66% SOC over the past 3 years
Better then 87% SOC

SiliconCat Rating

37
Ranks 37 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Dimensity 8400
MediaTek, December 2024
1668
Dimensity 7030
MediaTek, September 2023
1051
Dimensity 6300
MediaTek, April 2024
829
Helio G88
MediaTek, June 2021
427
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 8400
MediaTek, December 2024
6901
Dimensity 7100
MediaTek, January 2026
2921
Snapdragon 750G
Qualcomm, September 2020
2099
Kirin 960
HiSilicon, October 2016
1385
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Dimensity 8400
MediaTek, December 2024
1772345
Dimensity 8200
MediaTek, December 2022
938571
Dimensity 7300
MediaTek, May 2024
686609
T8300
Unisoc, March 2025
484395