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HiSilicon Kirin 990

HiSilicon Kirin 990

HiSilicon Kirin 990 is a SmartPhone Flagship platform from HiSilicon. It began to be released in October 2019. The SoC has 8 cores produced using 7 nm technology. And it also has a maximum frequency of 2860 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 64

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
October 2019
Manufacturing
TSMC
Model Name
Kirin 990
Architecture
2x 2.86 GHz – Cortex-A76 2x 2.36 GHz – Cortex-A76 4x 1.95 GHz – Cortex-A55
Cores
8
Technology
7 nm
Frequency
2860 MHz
Transistor count
8
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G76 MP16
GPU frequency
600 MHz
Max display resolution
3360 x 1440
FLOPS
0.6912 TFLOPS
Execution units
16
Shading units
36
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.0
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
34.1 Gbit/s

Miscellaneous

L2 Cache
2 MB
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Storage type
UFS 2.1, UFS 3.0
Video codecs
H.264, H.265, VC-1
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Da Vinci
TDP
6 W

Geekbench 6

Single Core
971
Multi Core
3155

FP32 (float)

712

Compared to Other SoC

20%
42%
70%
Better then 20% SOC over the past year
Better then 42% SOC over the past 3 years
Better then 70% SOC

SiliconCat Rating

64
Ranks 64 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 782G
Qualcomm, November 2022
1127
Kirin 990
HiSilicon, October 2019
971
Snapdragon 821
Qualcomm, August 2016
391
Snapdragon 625
Qualcomm, February 2016
189
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Tensor
Google, October 2021
3234
Kirin 990
HiSilicon, October 2019
3155
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
FP32 (float)
Dimensity 9200
MediaTek, November 2022
3699
Snapdragon 870
Qualcomm, January 2021
1358
Kirin 990
HiSilicon, October 2019
712
T820
Unisoc, November 2022
440
Dimensity 720
MediaTek, July 2020
330