Better then 2% SOC over the past year
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HiSilicon Kirin 970
HiSilicon Kirin 970 is a SmartPhone Flagship platform from HiSilicon. It began to be released in September 2017. The SoC has 8 cores produced using 10 nm technology. And it also has a maximum frequency of 2360 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Basic
Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
September 2017
Manufacturing
TSMC
Model Name
Hi3670
Architecture
4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53
Cores
8
Technology
10 nm
Frequency
2360 MHz
Transistor count
5.5
Instruction set
ARMv8-A
GPU Specifications
GPU name
Mali-G72 MP12
GPU frequency
768 MHz
Max display resolution
3120 x 1440
FLOPS
0.3318 TFLOPS
Execution units
12
Shading units
18
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12
Connectivity
4G support
LTE Cat. 18
5G support
No
Bluetooth
4.2
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo
Memory Specifications
Memory type
LPDDR4X
Memory frequency
1866 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
29.8 Gbit/s
Miscellaneous
L2 Cache
2 MB
Audio codecs
32 bit@384 kHz, HD-audio
Max camera resolution
1x 48MP, 2x 20MP
Storage type
UFS 2.1
Video codecs
H.264, H.265, VP8, VP9, VC-1
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
Yes
TDP
9 W
Geekbench 6
Single Core
386
Multi Core
1377
AnTuTu 10
366696
FP32 (float)
327
Compared to Other SoC
2%
2%
29%
Better then 2% SOC over the past 3 years
Better then 29% SOC
SiliconCat Rating
160
Ranks 160 among all SOC on our website
Geekbench 6 Single Core
Geekbench 6 Multi Core
AnTuTu 10
FP32 (float)
