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MediaTek Dimensity 7050

MediaTek Dimensity 7050

MediaTek Dimensity 7050 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2023. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 2600 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 88

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2023
Manufacturing
TSMC
Model Name
MT6877 MT6877V/TTZA
Architecture
2x 2.6 GHz – Cortex-A78 6x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2600 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G68 MP4
GPU frequency
800 MHz
Max display resolution
2520 x 1080
FLOPS
0.686 TFLOPS
Execution units
4
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 18
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit

Miscellaneous

Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 200MP
Storage type
UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
MediaTek APU 550
TDP
4 W

Geekbench 6

Single Core
962
Multi Core
2364

AnTuTu 10

540515

FP32 (float)

707

Compared to Other SoC

24%
28%
61%
Better then 24% SOC over the past year
Better then 28% SOC over the past 3 years
Better then 61% SOC

SiliconCat Rating

88
Ranks 88 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 7s Gen 3
Qualcomm, August 2024
1185
Dimensity 7050
MediaTek, May 2023
962
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Exynos 2100
Samsung, December 2020
3334
Dimensity 7050
MediaTek, May 2023
2364
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Snapdragon 7 Plus Gen 3
Qualcomm, March 2024
1485728
Dimensity 7350
MediaTek, July 2024
771535
Dimensity 7050
MediaTek, May 2023
540515
Dimensity 6100 Plus
MediaTek, July 2023
417246
Helio G88
MediaTek, June 2021
278717
FP32 (float)
Snapdragon 8 Gen 1
Qualcomm, December 2021
2487
Snapdragon 865
Qualcomm, December 2019
1214
Dimensity 7050
MediaTek, May 2023
707
Snapdragon 750G
Qualcomm, September 2020
426
Kirin 970
HiSilicon, September 2017
327

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