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MediaTek Dimensity 8350

MediaTek Dimensity 8350
MediaTek Dimensity 8350 is a SmartPhone Mid range platform from MediaTek. It began to be released in November 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3350 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Top SOC: 61

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
November 2024
Manufacturing
TSMC
Model Name
MT6897 MT6897Z_A/ZA MT8792Z/NA
Architecture
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
3350 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
FLOPS
2.1504 TFLOPS
Shading units
128
OpenCL version
2.0
Vulkan version
1.3

Connectivity

Download speed
Up to 5170 Mbps
4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L3 cache
4 MB
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
- H.264
- H.265
- AV1
- VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 780

Geekbench 6

Single Core
1298
Multi Core
4368

FP32 (float)

2172

AnTuTu 10

1417030

Compared to Other SoC

50%
51%
78%
Better then 50% SOC over the past year
Better then 51% SOC over the past 3 years
Better then 78% SOC

SiliconCat Rating

61
Ranks 61 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Dimensity 8550
MediaTek, May 2026
1611
Dimensity 8350
MediaTek, November 2024
1298
Dimensity 6300
MediaTek, April 2024
829
Helio G88
MediaTek, June 2021
427
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Exynos 1680
Samsung, March 2026
4492
Dimensity 8350
MediaTek, November 2024
4368
Snapdragon 750G
Qualcomm, September 2020
2099
Kirin 960
HiSilicon, October 2016
1385
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Snapdragon 8 Gen 1
Qualcomm, December 2021
2487
Dimensity 8350
MediaTek, November 2024
2172
Snapdragon 780G
Qualcomm, March 2021
744
Snapdragon 6 Gen 3
Qualcomm, September 2024
486
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Exynos 2400e
Samsung, September 2024
1724715
Dimensity 8350
MediaTek, November 2024
1417030
Dimensity 7300
MediaTek, May 2024
686609
T8300
Unisoc, March 2025
484395