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MediaTek Dimensity 8350

MediaTek Dimensity 8350
MediaTek Dimensity 8350 is a SmartPhone Mid range platform from MediaTek. It began to be released in November 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3350 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 53

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
November 2024
Manufacturing
TSMC
Model Name
MT6897 MT6897Z_A/ZA MT8792Z/NA
Architecture
1x 3.35 GHz – Cortex-A715 3x 3.2 GHz – Cortex-A715 4x 2.2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
3350 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
FLOPS
2.1504 TFLOPS
Shading units
128
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L3 cache
4 MB
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
- H.264 - H.265 - AV1 - VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 780

Geekbench 6

Single Core
1298
Multi Core
4368

FP32 (float)

2172

AnTuTu 10

1417030

Compared to Other SoC

37%
55%
79%
Better then 37% SOC over the past year
Better then 55% SOC over the past 3 years
Better then 79% SOC

SiliconCat Rating

53
Ranks 53 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Kirin 9010
HiSilicon, April 2024
1413
Dimensity 8350
MediaTek, November 2024
1298
Helio G99
MediaTek, May 2022
733
Exynos 9609
Samsung, May 2019
362
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 8350
MediaTek, November 2024
4368
Dimensity 7200 Ultra
MediaTek, September 2023
2705
Snapdragon 480 Plus
Qualcomm, October 2021
1859
Helio A22
MediaTek, June 2018
1149
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Kirin 9000
HiSilicon, October 2020
2354
Dimensity 8350
MediaTek, November 2024
2172
Kirin 990 5G
HiSilicon, October 2019
712
Snapdragon 6 Gen 4
Qualcomm, February 2025
453
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 9200 Plus
MediaTek, May 2023
1504887
Dimensity 8350
MediaTek, November 2024
1417030
Snapdragon 780G
Qualcomm, March 2021
627148
Snapdragon 6s Gen 3
Qualcomm, June 2024
457862