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MediaTek Dimensity 8350

MediaTek Dimensity 8350
MediaTek Dimensity 8350 is a SmartPhone Mid range platform from MediaTek. It began to be released in November 2024. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3350 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
New this year
Top SOC: 52

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
November 2024
Manufacturing
TSMC
Model Name
MT6897 MT6897Z_A/ZA MT8792Z/NA
Architecture
1x 3.35 GHz – Cortex-A715 3x 3.2 GHz – Cortex-A715 4x 2.2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
3350 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
FLOPS
2.1504 TFLOPS
Shading units
128
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
68.2 Gbit/s

Miscellaneous

Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
- H.264 - H.265 - AV1 - VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 780

Geekbench 6

Single Core
1298
Multi Core
4368

FP32 (float)

2172

AnTuTu 10

1417030

Compared to Other SoC

36%
55%
80%
Better then 36% SOC over the past year
Better then 55% SOC over the past 3 years
Better then 80% SOC

SiliconCat Rating

52
Ranks 52 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
Exynos 1580
Samsung, October 2024
1346
Dimensity 8350
MediaTek, November 2024
1298
Dimensity 700
MediaTek, November 2020
715
Kirin 710F
HiSilicon, January 2019
355
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8350
MediaTek, November 2024
4368
Dimensity 7200
MediaTek, February 2023
2651
Snapdragon 732G
Qualcomm, August 2020
1847
Kirin 710A
HiSilicon, June 2020
1135
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Kirin 9000
HiSilicon, October 2020
2354
Dimensity 8350
MediaTek, November 2024
2172
Kirin 990 5G
HiSilicon, October 2019
712
Snapdragon 6 Gen 4
Qualcomm, February 2025
453
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 9200
MediaTek, November 2022
1497795
Dimensity 8350
MediaTek, November 2024
1417030
Snapdragon 855 Plus
Qualcomm, July 2019
611952
Dimensity 6400
MediaTek, February 2025
450493