Top 100

MediaTek Dimensity 820

MediaTek Dimensity 820

MediaTek Dimensity 820 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2020. The SoC has 8 cores produced using 7 nm technology. And it also has a maximum frequency of 2600 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 85

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2020
Manufacturing
TSMC
Model Name
MT6875
Architecture
4x 2.6 GHz – Cortex-A76 4x 2 GHz – Cortex-A55
Cores
8
Technology
7 nm
Frequency
2600 MHz
Instruction set
ARMv8.3-A

GPU Specifications

GPU name
Mali-G57 MP5
GPU frequency
650 MHz
Max display resolution
2520 x 1080
FLOPS
0.416 TFLOPS
Execution units
5
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 18
5G support
Yes
Bluetooth
5.1
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit
Max Bandwidth
17.07 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 80MP, 2x 32MP
Storage type
UFS 2.2
Video codecs
H.264, H.265, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
Yes
TDP
8 W

Geekbench 6

Single Core
847
Multi Core
2494

AnTuTu 10

484228

FP32 (float)

428

Compared to Other SoC

11%
25%
60%
Better then 11% SOC over the past year
Better then 25% SOC over the past 3 years
Better then 60% SOC

SiliconCat Rating

85
Ranks 85 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Snapdragon 782G
Qualcomm, November 2022
1127
Dimensity 820
MediaTek, May 2020
847
Snapdragon 821
Qualcomm, August 2016
391
Snapdragon 625
Qualcomm, February 2016
189
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Tensor
Google, October 2021
3234
Dimensity 820
MediaTek, May 2020
2494
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
AnTuTu 10
A15 Bionic
Apple, September 2021
1302680
Dimensity 8050
MediaTek, May 2023
702079
Dimensity 820
MediaTek, May 2020
484228
Snapdragon 480
Qualcomm, January 2021
371113
Exynos 9610
Samsung, March 2018
252401
FP32 (float)
Snapdragon 865 Plus
Qualcomm, July 2020
1332
Kirin 990 5G
HiSilicon, October 2019
712
Dimensity 820
MediaTek, May 2020
428
Snapdragon 678
Qualcomm, December 2020
327
Snapdragon 660
Qualcomm, May 2017
219