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MediaTek Dimensity 810

MediaTek Dimensity 810

MediaTek Dimensity 810 is a SmartPhone Mid range platform from MediaTek. It began to be released in August 2021. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 2400 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 112

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
August 2021
Manufacturing
TSMC
Model Name
MT6833V
Architecture
2x 2.4 GHz – Cortex-A76 6x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2400 MHz
Transistor count
12
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G57 MP2
GPU frequency
950 MHz
Max display resolution
2520 x 1080
FLOPS
0.243 TFLOPS
Execution units
2
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 18
5G support
Yes
Bluetooth
5.1
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit
Max Bandwidth
17.07 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 64MP, 2x 16MP
Storage type
UFS 2.2
Video codecs
H.264, H.265, VP9
Video playback
2K at 30FPS
Video capture
2K at 30FPS
Neural processor (NPU)
MediaTek APU 3.0
TDP
6 W

Geekbench 6

Single Core
787
Multi Core
1945

AnTuTu 10

420291

FP32 (float)

236

Compared to Other SoC

15%
15%
50%
Better then 15% SOC over the past year
Better then 15% SOC over the past 3 years
Better then 50% SOC

SiliconCat Rating

112
Ranks 112 among all SOC on our website
Geekbench 6 Single Core
A15 Bionic
Apple, September 2021
2333
Dimensity 8020
MediaTek, April 2023
1124
Dimensity 810
MediaTek, August 2021
787
Snapdragon 835
Qualcomm, November 2016
415
Exynos 7420
Samsung, April 2015
195
Geekbench 6 Multi Core
Snapdragon 8 Gen 3
Qualcomm, October 2023
7085
Snapdragon 7s Gen 3
Qualcomm, August 2024
3118
Dimensity 810
MediaTek, August 2021
1945
Tiger T610
Unisoc, June 2019
1311
Helio P22
MediaTek, May 2018
729
AnTuTu 10
Snapdragon 870
Qualcomm, January 2021
802221
Dimensity 1050
MediaTek, May 2022
569995
Dimensity 810
MediaTek, August 2021
420291
Snapdragon 710
Qualcomm, May 2018
317619
Snapdragon 821
Qualcomm, August 2016
226130
FP32 (float)
Dimensity 820
MediaTek, May 2020
428
Snapdragon 678
Qualcomm, December 2020
327
Dimensity 810
MediaTek, August 2021
236
Tiger T615
Unisoc, August 2024
109
Kirin 659
HiSilicon, January 2017
59