Top 100

MediaTek Dimensity 7300

MediaTek Dimensity 7300

MediaTek Dimensity 7300 is an advanced mobile processor released in May 2024, designed for mid-range smartphones with 5G support.

Architecture and Performance

Dimensity 7300 has an eight-core processor configuration consisting of:

- Four high-performance Cortex-A78 cores clocked at up to 2.5 GHz

- Four energy-efficient Cortex-A55 cores with a frequency of 2.0 GHz

This configuration provides a good balance between performance and energy efficiency, allowing the devices to handle everyday tasks and more demanding applications.

Graphics and gaming performance

The Dimensity 7300 is powered by the Mali-G615 MC2 GPU, which is based on the 4th generation Valhall architecture.This provides decent graphics performance for mid-level games and other graphics-intensive tasks.

Production process and energy efficiency

The chipset is manufactured using TSMC's 4nm process technology, which improves power efficiency and performance. This allows Dimensity 7300-based devices to provide a good balance between power and battery life.

5G support and connectivity

Dimensity 7300 supports 5G networks, making it a suitable choice for today's future-proof smartphones. In addition, the chipset is equipped with support for Wi-Fi 6 and Bluetooth 5.4, providing rich wireless connectivity.

Multimedia capabilities

The processor supports displays with resolutions up to 2520 x 1080 pixels and can work with cameras up to 200 MP. It is also capable of processing 4K video at 30fps.

Application in devices

Dimensity 7300 is already found in several smartphones including Nothing CMF Phone 1, Oppo Reno 12 Pro 5G and Oppo Reno 12 5G, indicating its competitiveness in the mid-range market.

Overall, the MediaTek Dimensity 7300 appears to be a balanced solution for mid-range smartphones, offering good performance, energy efficiency and support for modern communication technologies.

Below are detailed characteristics and benchmark results.

Top SOC: 84

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2024
Manufacturing
tsmc
Model Name
Dimensity 7300
Architecture
4x Arm Cortex-A78 up to 2.5GHz, 4x Arm Cortex-A55
Cores
8
Technology
4 nm
Frequency
2500 MHz

GPU Specifications

GPU name
Mali-G615 MC2
Max display resolution
WFHD+ @ 120Hz Full HD+ @ 144Hz

Memory Specifications

Memory type
LPDDR4x LPDDR5
Memory frequency
Up to 6400Mbps

Miscellaneous

Max camera resolution
200MP
Storage type
UFS 3.1
Video codecs
H.264 HEVC VP-9
Video capture
4K30 (3840 x 2160)
Neural processor (NPU)
NPU 655

AnTuTu 10

Score
686609

Performance

CPU
Score
217533
GPU
Score
148951
Memory
Score
155640
UX
Score
164485
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AiTuTu 3

Score
103293

Performance

Image Classification
Score
60186
Object Detection
Score
31834
Super Resolution
Score
1354
Style Transfer
Score
9919
Show more

Geekbench 6

Single Core
1060
Multi Core
2900

Compared to Other SoC

20%
39%
66%
Better then 20% SOC over the past year
Better then 39% SOC over the past 3 years
Better then 66% SOC

SiliconCat Rating

84
Ranks 84 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
A12X Bionic
Apple, October 2018
1326
Dimensity 7300
MediaTek, May 2024
1060
Snapdragon 730
Qualcomm, April 2019
698
Snapdragon 665
Qualcomm, April 2019
337
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Snapdragon 888
Qualcomm, December 2020
3794
Dimensity 7300
MediaTek, May 2024
2900
Snapdragon 730G
Qualcomm, April 2019
1826
Snapdragon 636
Qualcomm, October 2017
1088
AnTuTu 10
Exynos 2400
Samsung, January 2024
1761715
Tensor G2
Google, October 2022
944612
Dimensity 7300
MediaTek, May 2024
686609
Dimensity 7060
MediaTek, May 2025
480699
Snapdragon 480 Plus
Qualcomm, October 2021
390901
AiTuTu 3
Dimensity 8200
MediaTek, December 2022
116752
Dimensity 8100
MediaTek, March 2022
112291
Dimensity 7300
MediaTek, May 2024
103293
Dimensity 1200
MediaTek, January 2021
94955
Dimensity 1100
MediaTek, January 2021
91390

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