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MediaTek Dimensity 7300

MediaTek Dimensity 7300

MediaTek Dimensity 7300 is an advanced mobile processor released in May 2024, designed for mid-range smartphones with 5G support. Architecture and Performance Dimensity 7300 has an eight-core processor configuration consisting of: Four high-performance Cortex-A78 cores clocked at up to 2.5 GHz Four energy-efficient Cortex-A55 cores with a frequency of 2.0 GHz This configuration provides a good balance between performance and energy efficiency, allowing the devices to handle everyday tasks and more demanding applications. Graphics and gaming performance The Dimensity 7300 is powered by the Mali-G615 MC2 GPU, which is based on the 4th generation Valhall architecture.This provides decent graphics performance for mid-level games and other graphics-intensive tasks. Production process and energy efficiency The chipset is manufactured using TSMC's 4nm process technology, which improves power efficiency and performance. This allows Dimensity 7300-based devices to provide a good balance between power and battery life. 5G support and connectivity Dimensity 7300 supports 5G networks, making it a suitable choice for today's future-proof smartphones. In addition, the chipset is equipped with support for Wi-Fi 6 and Bluetooth 5.4, providing rich wireless connectivity. Multimedia capabilities The processor supports displays with resolutions up to 2520 x 1080 pixels and can work with cameras up to 200 MP. It is also capable of processing 4K video at 30fps. Application in devices Dimensity 7300 is already found in several smartphones including Nothing CMF Phone 1, Oppo Reno 12 Pro 5G and Oppo Reno 12 5G, indicating its competitiveness in the mid-range market. Overall, the MediaTek Dimensity 7300 appears to be a balanced solution for mid-range smartphones, offering good performance, energy efficiency and support for modern communication technologies. Below are detailed characteristics and benchmark results.

New this year
Top SOC: 68

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2024
Manufacturing
tsmc
Model Name
Dimensity 7300
Architecture
4x Arm Cortex-A78 up to 2.5GHz, 4x Arm Cortex-A55
Cores
8
Technology
4 nm
Frequency
2500 MHz

GPU Specifications

GPU name
Mali-G615 MC2
Max display resolution
WFHD+ @ 120Hz Full HD+ @ 144Hz

Memory Specifications

Memory type
LPDDR4x LPDDR5
Memory frequency
Up to 6400Mbps

Miscellaneous

Max camera resolution
200MP
Storage type
UFS 3.1
Video codecs
H.264 HEVC VP-9
Video capture
4K30 (3840 x 2160)
Neural processor (NPU)
NPU 655

Geekbench 6

Single Core
1060
Multi Core
2900

AnTuTu 10

711402

Compared to Other SoC

36%
44%
70%
Better then 36% SOC over the past year
Better then 44% SOC over the past 3 years
Better then 70% SOC

SiliconCat Rating

68
Ranks 68 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 7200
MediaTek, February 2023
1188
Dimensity 7300
MediaTek, May 2024
1060
Helio G91
MediaTek, June 2024
433
Snapdragon 653
Qualcomm, October 2016
226
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Snapdragon 870
Qualcomm, January 2021
3336
Dimensity 7300
MediaTek, May 2024
2900
Helio G91
MediaTek, June 2024
1403
Helio P23
MediaTek, August 2017
822
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 7300
MediaTek, May 2024
711402
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691

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