Snapdragon 778G Plus
Qualcomm Snapdragon 778G Plus vs MediaTek Dimensity 7300
SoC Comparison Result
Below are the results of a comparison of the characteristics and performance of the Qualcomm Snapdragon 778G Plus and MediaTek Dimensity 7300 mobile processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
Qualcomm
MediaTek
Launch Date
October 2021
May 2024
Platform
SmartPhone Mid range
SmartPhone Mid range
Manufacturing
TSMC
tsmc
Model Name
SM7325-AE
Dimensity 7300
Architecture
1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
4x Arm Cortex-A78 up to 2.5GHz, 4x Arm Cortex-A55
Cores
8
8
Technology
6 nm
4 nm
Frequency
2500 MHz
2500 MHz
Instruction set
ARMv8.2-A
-
GPU Specifications
GPU name
Adreno 642
Mali-G615 MC2
GPU frequency
550 MHz
-
Max display resolution
2520 x 1080
WFHD+ @ 120Hz Full HD+ @ 144Hz
FLOPS
0.8448 TFLOPS
-
Execution units
2
-
Shading units
384
-
OpenCL version
2.0
-
Vulkan version
1.1
-
DirectX version
12.1
-
Connectivity
4G support
LTE Cat. 24
-
5G support
Yes
-
Bluetooth
5.2
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
-
Memory Specifications
Memory type
LPDDR5
LPDDR4x LPDDR5
Memory frequency
3200 MHz
Up to 6400Mbps
Memory Bus
2x 16 Bit
-
Max Bandwidth
25.6 Gbit/s
-
Miscellaneous
L2 Cache
2 MB
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 192MP
200MP
Storage type
UFS 2.2, UFS 3.0, UFS 3.1
UFS 3.1
Video codecs
H.264, H.265, VP8, VP9
H.264 HEVC VP-9
Video playback
4K at 30FPS
-
Video capture
4K at 30FPS
4K30 (3840 x 2160)
Neural processor (NPU)
Hexagon 770
NPU 655
TDP
5 W
-
Advantages
Dimensity 7300
- Higher Technology: 4 nm (6 nm vs 4 nm)
- Newer Launch Date: May 2024 (October 2021 vs May 2024)
Geekbench 6
Single Core
Snapdragon 778G Plus
+1%
1069
Dimensity 7300
1060
Multi Core
Snapdragon 778G Plus
+4%
3008
Dimensity 7300
2900
AnTuTu 10
Snapdragon 778G Plus
610387
Dimensity 7300
+17%
711402
Related articles
Date:
05 July 2024
Date:
05 July 2024
MediaTek has expanded its line of mobile platforms by introducing the latest models Dimensity 7300 and Dimensity 7300X. These chips are designed for mid-range devices and are manufactured on a 4nm process technology, delivering superior power efficie...
SiliconCat Rating
60
Ranks 60 among all SOC on our website
62
Ranks 62 among all SOC on our website
Dimensity 7300
