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MediaTek Dimensity 8200

MediaTek Dimensity 8200

MediaTek Dimensity 8200 is a SmartPhone Flagship platform from MediaTek. It began to be released in December 2022. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3100 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 39

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
December 2022
Manufacturing
TSMC
Model Name
MT6896Z
Architecture
1x 3.1 GHz – Cortex A78 3x 3 GHz – Cortex A78 4x 2 GHz – Cortex A55
Cores
8
Technology
4 nm
Frequency
3100 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G610 MP6
GPU frequency
950 MHz
Max display resolution
2960 x 1440
FLOPS
1.442 TFLOPS
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 580
TDP
6 W

Geekbench 6

Single Core
1229
Multi Core
3892

AnTuTu 10

906478

FP32 (float)

1399

Compared to Other SoC

44%
59%
82%
Better then 44% SOC over the past year
Better then 59% SOC over the past 3 years
Better then 82% SOC

SiliconCat Rating

39
Ranks 39 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 8200
MediaTek, December 2022
1229
Kirin 980
HiSilicon, August 2018
835
Helio G85
MediaTek, April 2020
416
Snapdragon 430
Qualcomm, September 2015
206
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8200
MediaTek, December 2022
3892
Snapdragon 750G
Qualcomm, September 2020
2099
Helio G80
MediaTek, February 2020
1354
Snapdragon 821
Qualcomm, August 2016
797
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9000S
HiSilicon, August 2023
932745
Dimensity 8200
MediaTek, December 2022
906478
T760
Unisoc, July 2024
454691
A10 Fusion
Apple, September 2016
350844
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
A16 Bionic
Apple, September 2022
1770
Dimensity 8200
MediaTek, December 2022
1399
Kirin 980
HiSilicon, August 2018
523
Snapdragon 730
Qualcomm, April 2019
347

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