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MediaTek Dimensity 8200

MediaTek Dimensity 8200

MediaTek Dimensity 8200 is a SmartPhone Flagship platform from MediaTek. It began to be released in December 2022. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3100 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 42

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
December 2022
Manufacturing
TSMC
Model Name
MT6896Z
Architecture
1x 3.1 GHz – Cortex A78 3x 3 GHz – Cortex A78 4x 2 GHz – Cortex A55
Cores
8
Technology
4 nm
Frequency
3100 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G610 MP6
GPU frequency
950 MHz
Max display resolution
2960 x 1440
FLOPS
1.442 TFLOPS
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.3
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
3200 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
51.2 Gbit/s

Miscellaneous

Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 580
TDP
6 W

Geekbench 6

Single Core
1229
Multi Core
3892

AnTuTu 10

906478

FP32 (float)

1399

Compared to Other SoC

50%
60%
82%
Better then 50% SOC over the past year
Better then 60% SOC over the past 3 years
Better then 82% SOC

SiliconCat Rating

42
Ranks 42 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 8200
MediaTek, December 2022
1229
Exynos 1280
Samsung, March 2022
852
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8200
MediaTek, December 2022
3892
A10X Fusion
Apple, June 2017
2201
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 8200
MediaTek, December 2022
906478
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
A18
Apple, September 2024
1771
Dimensity 8200
MediaTek, December 2022
1399
A12 Bionic
Apple, September 2018
594
Exynos 9810
Samsung, January 2018
381

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