Top 500

HiSilicon Kirin 960

HiSilicon Kirin 960

HiSilicon Kirin 960 is a SmartPhone Flagship platform from HiSilicon. It began to be released in October 2016. The SoC has 8 cores produced using 16 nm technology. And it also has a maximum frequency of 2360 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 145

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
October 2016
Manufacturing
TSMC
Model Name
Hi3660
Architecture
4x 2.36 GHz – Cortex-A73 4x 1.84 GHz – Cortex-A53
Cores
8
Technology
16 nm
Frequency
2360 MHz
Transistor count
4
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G71 MP8
GPU frequency
1037 MHz
Max display resolution
2560 x 1600
FLOPS
0.2655 TFLOPS
Execution units
8
Shading units
16
OpenCL version
2.0
Vulkan version
1.3
DirectX version
11.3

Connectivity

4G support
LTE Cat. 12
5G support
No
Bluetooth
4.2
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR4
Memory frequency
1600 MHz
Memory Bus
2x 32 Bit
Max Bandwidth
28.8 Gbit/s

Miscellaneous

L2 Cache
4 MB
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
2x 16MP
Storage type
eMMC 5.1, UFS 2.1
Video codecs
H.264, H.265, VP8, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
No
TDP
5 W

Geekbench 6

Single Core
408
Multi Core
1385

AnTuTu 10

276071

FP32 (float)

257

Compared to Other SoC

0%
1%
32%
Better then 0% SOC over the past year
Better then 1% SOC over the past 3 years
Better then 32% SOC

SiliconCat Rating

145
Ranks 145 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9300
MediaTek, November 2023
2225
Snapdragon 780G
Qualcomm, March 2021
1045
Helio G99
MediaTek, May 2022
733
Kirin 960
HiSilicon, October 2016
408
MT6750
MediaTek, August 2016
138
Geekbench 6 Multi Core
A16 Bionic
Apple, September 2022
6685
Snapdragon 855 Plus
Qualcomm, July 2019
2865
Snapdragon 480 Plus
Qualcomm, October 2021
1859
Kirin 960
HiSilicon, October 2016
1385
MT6750
MediaTek, August 2016
402
AnTuTu 10
Snapdragon 855
Qualcomm, December 2018
609911
Dimensity 800U
MediaTek, August 2020
447621
Exynos 8895
Samsung, February 2017
347863
Kirin 960
HiSilicon, October 2016
276071
Kirin 659
HiSilicon, January 2017
102892
FP32 (float)
Exynos 9820
Samsung, November 2018
625
Snapdragon 712
Qualcomm, February 2019
396
Kirin 960
HiSilicon, October 2016
257
Snapdragon 650
Qualcomm, February 2015
158
Exynos 7880
Samsung, January 2017
88