Top 500

HiSilicon Kirin 960

HiSilicon Kirin 960

HiSilicon Kirin 960 is a SmartPhone Flagship platform from HiSilicon. It began to be released in October 2016. The SoC has 8 cores produced using 16 nm technology. And it also has a maximum frequency of 2360 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 153

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
October 2016
Manufacturing
TSMC
Model Name
Hi3660
Architecture
4x 2.36 GHz – Cortex-A73 4x 1.84 GHz – Cortex-A53
Cores
8
Technology
16 nm
Frequency
2360 MHz
Transistor count
4
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G71 MP8
GPU frequency
1037 MHz
Max display resolution
2560 x 1600
FLOPS
0.2655 TFLOPS
Execution units
8
Shading units
16
OpenCL version
2.0
Vulkan version
1.3
DirectX version
11.3

Connectivity

4G support
LTE Cat. 12
5G support
No
Bluetooth
4.2
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR4
Memory frequency
1600 MHz
Memory Bus
2x 32 Bit
Max Bandwidth
28.8 Gbit/s

Miscellaneous

L2 Cache
4 MB
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
2x 16MP
Storage type
eMMC 5.1, UFS 2.1
Video codecs
H.264, H.265, VP8, VP9
Video playback
4K at 30FPS
Video capture
4K at 30FPS
Neural processor (NPU)
No
TDP
5 W

Geekbench 6

Single Core
408
Multi Core
1385

AnTuTu 10

276071

FP32 (float)

257

Compared to Other SoC

2%
2%
31%
Better then 2% SOC over the past year
Better then 2% SOC over the past 3 years
Better then 31% SOC

SiliconCat Rating

153
Ranks 153 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9200
MediaTek, November 2022
1949
Exynos 1380
Samsung, February 2023
1008
Dimensity 6020
MediaTek, March 2023
732
Kirin 960
HiSilicon, October 2016
408
MT6750
MediaTek, August 2016
138
Geekbench 6 Multi Core
Dimensity 8300
MediaTek, November 2023
4844
Snapdragon 778G
Qualcomm, May 2021
2787
Helio G90T
MediaTek, July 2019
1850
Kirin 960
HiSilicon, October 2016
1385
MT6750
MediaTek, August 2016
402
AnTuTu 10
Snapdragon 6 Gen 1
Qualcomm, September 2022
588454
Dimensity 6080
MediaTek, June 2023
435944
Snapdragon 835
Qualcomm, November 2016
342710
Kirin 960
HiSilicon, October 2016
276071
Kirin 659
HiSilicon, January 2017
102892
FP32 (float)
Dimensity 900
MediaTek, May 2021
603
Snapdragon 720G
Qualcomm, January 2020
388
Kirin 960
HiSilicon, October 2016
257
Snapdragon 650
Qualcomm, February 2015
158
Exynos 9609
Samsung, May 2019
88