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MediaTek Dimensity 8450

MediaTek Dimensity 8450
MediaTek Dimensity 8450 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2025. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3250 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Top SOC: 42

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2025
Manufacturing
TSMC
Model Name
Dimensity 8450
Architecture
1x 3.25 GHz – Cortex-A725
3x 3 GHz – Cortex-A725
4x 2.1 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3250 MHz
Instruction set
ARMv9.2-A

GPU Specifications

GPU name
Mali-G720 MP7
GPU frequency
1300 MHz
Max display resolution
2960 x 1440
FLOPS
2.3296 TFLOPS
Shading units
128
OpenCL version
3.2
Vulkan version
1.3
DirectX version
12

Connectivity

Download speed
Up to 5170 Mbps
5G support
Yes
Bluetooth
6.0
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L2 Cache
1 MB
L3 cache
6 MB
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Max camera resolution
1x 320MP, 3x 32MP
Storage type
UFS 4.0
Video codecs
- H.264
- H.265
- AV1
- VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

Geekbench 6

Single Core
1633
Multi Core
6470

FP32 (float)

2306

AnTuTu 10

1692262

Compared to Other SoC

62%
63%
85%
Better then 62% SOC over the past year
Better then 63% SOC over the past 3 years
Better then 85% SOC

SiliconCat Rating

42
Ranks 42 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Dimensity 8450
MediaTek, May 2025
1633
Dimensity 7030
MediaTek, September 2023
1051
Dimensity 6300
MediaTek, April 2024
829
Helio G88
MediaTek, June 2021
427
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 8450
MediaTek, May 2025
6470
Dimensity 7100
MediaTek, January 2026
2921
Snapdragon 750G
Qualcomm, September 2020
2099
Kirin 960
HiSilicon, October 2016
1385
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Snapdragon 8 Gen 1
Qualcomm, December 2021
2487
Dimensity 8450
MediaTek, May 2025
2306
Snapdragon 780G
Qualcomm, March 2021
744
Snapdragon 6 Gen 3
Qualcomm, September 2024
486
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Exynos 2400e
Samsung, September 2024
1724715
Dimensity 8450
MediaTek, May 2025
1692262
Dimensity 7300
MediaTek, May 2024
686609
T8300
Unisoc, March 2025
484395