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MediaTek Dimensity 8450

MediaTek Dimensity 8450
MediaTek Dimensity 8450 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2025. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3250 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 36

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2025
Manufacturing
TSMC
Model Name
Dimensity 8450
Architecture
1x 3.25 GHz – Cortex-A725 3x 3 GHz – Cortex-A725 4x 2.1 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3250 MHz
Instruction set
ARMv9.2-A

GPU Specifications

GPU name
Mali-G720 MP7
GPU frequency
1300 MHz
Max display resolution
2960 x 1440
FLOPS
2.3296 TFLOPS
Shading units
128
OpenCL version
3.2
Vulkan version
1.3
DirectX version
12

Connectivity

5G support
Yes
Bluetooth
6.0
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
68.2 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Max camera resolution
1x 320MP, 3x 32MP
Storage type
UFS 4.0
Video codecs
- H.264 - H.265 - AV1 - VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

Geekbench 6

Single Core
1633
Multi Core
6470

FP32 (float)

2306

AnTuTu 10

1692262

Compared to Other SoC

50%
66%
86%
Better then 50% SOC over the past year
Better then 66% SOC over the past 3 years
Better then 86% SOC

SiliconCat Rating

36
Ranks 36 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
Dimensity 8450
MediaTek, May 2025
1633
Snapdragon 778G
Qualcomm, May 2021
981
Dimensity 700
MediaTek, November 2020
715
Kirin 710F
HiSilicon, January 2019
355
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8450
MediaTek, May 2025
6470
Dimensity 7200
MediaTek, February 2023
2651
Snapdragon 732G
Qualcomm, August 2020
1847
Kirin 710A
HiSilicon, June 2020
1135
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Kirin 9000
HiSilicon, October 2020
2354
Dimensity 8450
MediaTek, May 2025
2306
Kirin 990 5G
HiSilicon, October 2019
712
Snapdragon 6 Gen 4
Qualcomm, February 2025
453
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 8450
MediaTek, May 2025
1692262
Exynos 1580
Samsung, October 2024
833130
Snapdragon 855 Plus
Qualcomm, July 2019
611952
Dimensity 6400
MediaTek, February 2025
450493