Dimensity 8300
MediaTek Dimensity 8300 vs HiSilicon Kirin 9010
SoC Comparison Result
Below are the results of a comparison of the characteristics and performance of the MediaTek Dimensity 8300 and HiSilicon Kirin 9010 mobile processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
MediaTek
HiSilicon
Launch Date
November 2023
April 2024
Platform
SmartPhone Flagship
SmartPhone Flagship
Manufacturing
TSMC
SMIC
Model Name
Dimensity 8300
Kirin 9010
Architecture
1x 3.35 GHz – Cortex-A715
3x 3.2 GHz – Cortex-A715
4x 2.2 GHz – Cortex-A510
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Cores
8
12
Technology
4 nm
7 nm
Frequency
3350 MHz
2300 MHz
Instruction set
ARMv9-A
-
GPU Specifications
GPU name
Mali-G615 MP6
Maleoon 910
GPU frequency
1400 MHz
750 MHz
Max display resolution
2960 x 1440
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
-
Connectivity
5G support
Yes
-
Bluetooth
5.4
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
-
Memory Specifications
Memory type
LPDDR5X
-
Memory frequency
4266 MHz
2750 MHz
Memory Bus
4x 16 Bit
4x 16 Bit
Max Bandwidth
68.2 Gbit/s
44 Gbit/s
Miscellaneous
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 320MP
-
Storage type
UFS 4.0
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
Video capture
4K at 60FPS
-
Neural processor (NPU)
MediaTek APU 780
-
Advantages
Dimensity 8300
- Higher Technology: 4 nm (4 nm vs 7 nm)
- Higher Frequency: 3350 MHz (3350 MHz vs 2300 MHz)
- Higher Max Bandwidth: 68.2 Gbit/s (68.2 Gbit/s vs 44 Gbit/s)
Kirin 9010
- Newer Launch Date: April 2024 (November 2023 vs April 2024)
Geekbench 6
Single Core
Dimensity 8300
+7%
1506
Kirin 9010
1413
Multi Core
Dimensity 8300
+6%
4844
Kirin 9010
4560
AnTuTu 10
Dimensity 8300
+58%
1502988
Kirin 9010
950322
SiliconCat Rating
25
Ranks 25 among all SOC on our website
29
Ranks 29 among all SOC on our website
Kirin 9010
