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MediaTek Dimensity 8300

MediaTek Dimensity 8300

MediaTek Dimensity 8300 is a SmartPhone Flagship platform from MediaTek. It began to be released in November 2023. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3350 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

New this year
Top SOC: 24

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
November 2023
Manufacturing
TSMC
Model Name
Dimensity 8300
Architecture
1x 3.35 GHz – Cortex-A715 3x 3.2 GHz – Cortex-A715 4x 2.2 GHz – Cortex-A510
Cores
8
Technology
4 nm
Frequency
3350 MHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G615 MP6
GPU frequency
1400 MHz
Max display resolution
2960 x 1440
Execution units
6
OpenCL version
2.0
Vulkan version
1.3

Connectivity

5G support
Yes
Bluetooth
5.4
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
68.2 Gbit/s

Miscellaneous

Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 780

Geekbench 6

Single Core
1506
Multi Core
4844

AnTuTu 10

1502988

Compared to Other SoC

45%
70%
89%
Better then 45% SOC over the past year
Better then 70% SOC over the past 3 years
Better then 89% SOC

SiliconCat Rating

24
Ranks 24 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 8300
MediaTek, November 2023
1506
Dimensity 810
MediaTek, August 2021
787
Snapdragon 821
Qualcomm, August 2016
391
Snapdragon 625
Qualcomm, February 2016
189
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8300
MediaTek, November 2023
4844
Dimensity 6100 Plus
MediaTek, July 2023
1965
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Dimensity 8300
MediaTek, November 2023
1502988
Kirin 980
HiSilicon, August 2018
589127
Snapdragon 4 Gen 2
Qualcomm, June 2023
423776
Snapdragon 680
Qualcomm, October 2021
319423

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