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MediaTek Dimensity 6400

MediaTek Dimensity 6400
MediaTek Dimensity 6400 is a SmartPhone Mid range platform from MediaTek. It began to be released in February 2025. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 2500 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
New this year
Top SOC: 133

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
February 2025
Manufacturing
TSMC
Model Name
Dimensity 6400
Architecture
2x 2.5 GHz – Cortex-A76 6x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2500 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G57 MP2
Max display resolution
2520 x 1080
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

5G support
Yes
Bluetooth
5.4
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit

Miscellaneous

L3 cache
2 MB
L2 Cache
1 MB
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Max camera resolution
1x 108MP, 2x 16MP
Storage type
UFS 2.2
Video codecs
- H.264 - H.265 - VP9
Video playback
2K at 30FPS
Video capture
2K at 30FPS
Neural processor (NPU)
Yes

AnTuTu 10

Score
450493

Performance

CPU
Score
145221
GPU
Score
75733
Memory
Score
104053
UX
Score
125486
Show more

Geekbench 6

Single Core
795
Multi Core
2137

Compared to Other SoC

6%
15%
48%
Better then 6% SOC over the past year
Better then 15% SOC over the past 3 years
Better then 48% SOC

SiliconCat Rating

133
Ranks 133 among all SOC on our website
Geekbench 6 Single Core
Tensor G3
Google, October 2023
1767
Dimensity 7400
MediaTek, February 2025
1069
Dimensity 6400
MediaTek, February 2025
795
Helio G80
MediaTek, February 2020
417
Helio G37
MediaTek, June 2020
206
Geekbench 6 Multi Core
Tensor G5
Google, August 2025
5769
Kirin 990
HiSilicon, October 2019
3155
Dimensity 6400
MediaTek, February 2025
2137
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Kirin 9000S
HiSilicon, August 2023
815008
Snapdragon 855
Qualcomm, December 2018
610389
Dimensity 6400
MediaTek, February 2025
450493
Snapdragon 835
Qualcomm, November 2016
372293
Exynos 9610
Samsung, March 2018
257323