MediaTek Dimensity 9300 vs HiSilicon Kirin 9010

MediaTek
Dimensity 9300
vs
HiSilicon
Kirin 9010
Specifications of SoCs

SoC Comparison Result

Below are the results of a comparison of the characteristics and performance of the MediaTek Dimensity 9300 and HiSilicon Kirin 9010 mobile processors. This comparison will help you determine which one best suits your needs.

Basic

Label Name
MediaTek
HiSilicon
Launch Date
November 2023
April 2024
Platform
SmartPhone Flagship
SmartPhone Flagship
Manufacturing
TSMC
SMIC
Model Name
Dimensity 9300
Kirin 9010
Architecture
4x 3.25 GHz – Cortex-X4 4x 2 GHz – Cortex-A720
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Cores
8
12
Technology
4 nm
7 nm
Frequency
3250 MHz
2300 MHz
Instruction set
ARMv9.2-A
-

GPU Specifications

GPU name
Mali Immortalis-G720 MC12
Maleoon 910
GPU frequency
1300 MHz
750 MHz
Max display resolution
2960 x 1440
-
FLOPS
5.9904 TFLOPS
-

Memory Specifications

Memory type
LPDDR5T
-
Memory frequency
9600 MHz
2750 MHz
Memory Bus
4x 16 Bit
4x 16 Bit
Max Bandwidth
76.8 Gbit/s
44 Gbit/s

Miscellaneous

L2 Cache
3.5
-
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 320MP
-
Storage type
UFS 4 + MCQ
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
8K at 30FPS, 4K at 60FPS
-
Video capture
8K at 30FPS, 4K at 60FPS
-
Neural processor (NPU)
MediaTek NPU 790 (Generative AI)
-

Advantages

MediaTek Dimensity 9300
Dimensity 9300
  • Higher Technology: 4 nm (4 nm vs 7 nm)
  • Higher Frequency: 3250 MHz (3250 MHz vs 2300 MHz)
  • Higher Max Bandwidth: 76.8 Gbit/s (76.8 Gbit/s vs 44 Gbit/s)
HiSilicon Kirin 9010
Kirin 9010
  • Newer Launch Date: April 2024 (November 2023 vs April 2024)

Geekbench 6

Single Core
Dimensity 9300
+57% 2225
Kirin 9010
1413
Multi Core
Dimensity 9300
+72% 7857
Kirin 9010
4560

AnTuTu 10

Dimensity 9300
+122% 2109832
Kirin 9010
950322

SiliconCat Rating

11
Ranks 11 among all SOC on our website
31
Ranks 31 among all SOC on our website
Dimensity 9300
Kirin 9010

Related SoC Comparisons