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HiSilicon Kirin 710F

HiSilicon Kirin 710F

HiSilicon Kirin 710F is a SmartPhone Mid range platform from HiSilicon. It began to be released in January 2019. The SoC has 8 cores produced using 12 nm technology. And it also has a maximum frequency of 2200 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 156

Basic

Label Name
HiSilicon
Platform
SmartPhone Mid range
Launch Date
January 2019
Manufacturing
TSMC
Model Name
Kirin 710F
Architecture
4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53
Cores
8
Technology
12 nm
Frequency
2200 MHz
Transistor count
5.5
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G51 MP4
GPU frequency
1000 MHz
Max display resolution
2340 x 1080
FLOPS
0.128 TFLOPS
Execution units
4
Shading units
16
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 12
5G support
No
Bluetooth
4.2
Wi-Fi
4
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR4X
Memory frequency
1866 MHz
Memory Bus
2x 32 Bit

Miscellaneous

L2 Cache
512 KB
Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 48MP, 2x 24MP
Storage type
eMMC 5.1, UFS 2.1
Video codecs
H.264, H.265, VP8, VP9
Video playback
1080p at 60FPS
Video capture
1K at 30FPS
Neural processor (NPU)
No
TDP
5 W

Geekbench 6

Single Core
355
Multi Core
1255

AnTuTu 10

249186

FP32 (float)

132

Compared to Other SoC

0%
1%
27%
Better then 0% SOC over the past year
Better then 1% SOC over the past 3 years
Better then 27% SOC

SiliconCat Rating

156
Ranks 156 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9300
MediaTek, November 2023
2225
Snapdragon 780G
Qualcomm, March 2021
1045
Helio G99
MediaTek, May 2022
733
Kirin 710F
HiSilicon, January 2019
355
MT6750
MediaTek, August 2016
138
Geekbench 6 Multi Core
A16 Bionic
Apple, September 2022
6685
Snapdragon 855 Plus
Qualcomm, July 2019
2865
Snapdragon 480 Plus
Qualcomm, October 2021
1859
Kirin 710F
HiSilicon, January 2019
1255
MT6750
MediaTek, August 2016
402
AnTuTu 10
Snapdragon 855
Qualcomm, December 2018
609911
Dimensity 800U
MediaTek, August 2020
447621
Exynos 8895
Samsung, February 2017
347863
Kirin 710F
HiSilicon, January 2019
249186
Kirin 659
HiSilicon, January 2017
102892
FP32 (float)
Snapdragon 710
Qualcomm, May 2018
372
A9
Apple, September 2015
246
Kirin 710F
HiSilicon, January 2019
132
Helio P65
MediaTek, June 2019
81
Exynos 850
Samsung, May 2020
38