Top 100

MediaTek Dimensity 7350

MediaTek Dimensity 7350

MediaTek has announced the new Dimensity 7350 chip for mid-range smartphones, which promises to set new standards in this segment. This is another chip in the Dimensity 7000 series, released using Armv9 processor cores and manufactured on the “second generation” 4nm process from TSMC (presumably N4P). MediaTek hasn't specified an exact release date for the Dimensity 7350, but it is expected to arrive in the coming weeks.

Main characteristics

  • Manufacturer: MediaTek
  • Release date: July 2024
  • Architecture: Armv9
  • Cores: 8 (2x Cortex-A715 up to 3 GHz, 6x Cortex-A510)
  • Process technology: 4 nm (second generation)
  • Frequency: up to 3 GHz
  • Graphics Processing Unit (GPU): Mali-G610 MC4
  • Maximum display resolution: Full HD+ @ 144 Hz
  • Memory: LPDDR5X up to 6400 Mbps
  • Storage: UFS 3.1
  • Artificial Intelligence (NPU): MediaTek NPU 657

Performance

The Dimensity 7350 promises high performance with a dual-cluster CPU architecture that includes two powerful Cortex-A715 cores clocked at up to 3.0 GHz and six power-efficient Cortex-A510 cores. The Mali-G610 MC4 GPU provides excellent performance in games and graphics applications.

Camera and display support

Dimensity 7350 is equipped with MediaTek Imagiq 765 ISP, which supports camera modules up to 200 MP and 14-bit HDR. Video recording is possible in 4K resolution at 40 frames per second. All major HDR standards are supported, including HDR10+, CUVA HDR and Dolby HDR. The maximum display specification is limited to Full HD+ with a refresh rate of 144 Hz.

Communication and Connection

  • 5G:Supports the latest communications standards, including 5G, for high data speeds and low latency.
  • Wi-Fi:Supports Wi-Fi 6E for high speed and stable connection.
  • Bluetooth: Support Bluetooth 5.3.
  • Navigation: Support GPS, GLONASS, Beidou, Galileo, QZSS.

Energy efficiency

Thanks to the advanced 4nm process technology and optimized Armv9 cores, Dimensity 7350 promises high power efficiency, which will have a positive impact on the battery life of devices.

Conclusion

MediaTek Dimensity 7350 is a powerful solution for mid-range smartphones, offering significant improvements in performance and supporting modern technologies. The combination of high-performance cores, a powerful GPU and advanced camera capabilities makes this chip a great choice for users looking for powerful and technologically advanced devices at a reasonable price.

New this year
Top SOC: 65

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
July 2024
Manufacturing
TSMC
Architecture
Arm
Cores
Octa (8) 2x Arm Cortex-A715 up to 3GHz 6x Arm Cortex-A510
Technology
4nm
Frequency
3GHz
Instruction set
ARMv9-A

GPU Specifications

GPU name
Mali-G610 MC4
Max display resolution
Full HD+ @ 144Hz

Connectivity

4G support
yes
5G support
yes
Bluetooth
5.3
Wi-Fi
Wi-Fi 6E (a/b/g/n/ac/ax)
Navigation
GPS BeiDou Glonass Galileo QZSS NavIC

Memory Specifications

Memory type
LPDDR5 LPDDR4x
Memory frequency
Up to 6400Mbps

Miscellaneous

Max camera resolution
200MP, 4K30 (3840 x 2160)
Storage type
UFS 3.1
Video codecs
H.264 HEVC
Video playback
H.264 HEVC VP-9
Neural processor (NPU)
MediaTek NPU 657

Geekbench 6

Single Core
1198
Multi Core
2634

AnTuTu 10

771535

FP32 (float)

1340

Compared to Other SoC

37%
45%
71%
Better then 37% SOC over the past year
Better then 45% SOC over the past 3 years
Better then 71% SOC

SiliconCat Rating

65
Ranks 65 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 7350
MediaTek, July 2024
1198
Exynos 1280
Samsung, March 2022
852
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Exynos 2100
Samsung, December 2020
3334
Dimensity 7350
MediaTek, July 2024
2634
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 7350
MediaTek, July 2024
771535
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
A18
Apple, September 2024
1771
Dimensity 7350
MediaTek, July 2024
1340
A12 Bionic
Apple, September 2018
594
Exynos 9810
Samsung, January 2018
381