Dimensity 1300
MediaTek Dimensity 1300 vs HiSilicon Kirin 9010
SoC Comparison Result
Below are the results of a comparison of the characteristics and performance of the MediaTek Dimensity 1300 and HiSilicon Kirin 9010 mobile processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
MediaTek
HiSilicon
Launch Date
March 2022
April 2024
Platform
SmartPhone Flagship
SmartPhone Flagship
Manufacturing
TSMC
SMIC
Model Name
MT6893Z
Kirin 9010
Architecture
1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
2x 2.3 GHz – TaiShan V1214x 1.55 GHz – TaiShan V1216x 2.18 GHz – Cortex-A510
Cores
8
12
Technology
6 nm
7 nm
Frequency
3000 MHz
2300 MHz
Instruction set
ARMv8.2-A
-
GPU Specifications
GPU name
Mali-G77 MP9
Maleoon 910
GPU frequency
850 MHz
750 MHz
Max display resolution
2520 x 1080
-
FLOPS
0.9792 TFLOPS
-
Execution units
9
-
Shading units
64
-
OpenCL version
2.0
-
Vulkan version
1.3
-
DirectX version
12
-
Connectivity
4G support
LTE Cat. 19
-
5G support
Yes
-
Bluetooth
5.2
-
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
-
Memory Specifications
Memory type
LPDDR4X
-
Memory frequency
2133 MHz
2750 MHz
Memory Bus
4x 16 Bit
4x 16 Bit
Max Bandwidth
34.1 Gbit/s
44 Gbit/s
Miscellaneous
Audio codecs
AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP
-
Storage type
UFS 3.1
-
Video codecs
H.264, H.265, AV1, VP9
-
Video playback
4K at 60FPS
-
Video capture
4K at 60FPS
-
Neural processor (NPU)
MediaTek APU 3.0
-
Advantages
Dimensity 1300
- Higher Technology: 6 nm (6 nm vs 7 nm)
- Higher Frequency: 3000 MHz (3000 MHz vs 2300 MHz)
Kirin 9010
- Higher Max Bandwidth: 44 Gbit/s (34.1 Gbit/s vs 44 Gbit/s)
- Newer Launch Date: April 2024 (March 2022 vs April 2024)
Geekbench 6
Single Core
Dimensity 1300
1252
Kirin 9010
+13%
1413
Multi Core
Dimensity 1300
3457
Kirin 9010
+32%
4560
AnTuTu 10
Dimensity 1300
691386
Kirin 9010
+37%
950322
SiliconCat Rating
46
Ranks 46 among all SOC on our website
33
Ranks 33 among all SOC on our website
Kirin 9010
