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MediaTek Dimensity 1300

MediaTek Dimensity 1300

MediaTek Dimensity 1300 is a SmartPhone Flagship platform from MediaTek. It began to be released in March 2022. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 3000 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 46

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
March 2022
Manufacturing
TSMC
Model Name
MT6893Z
Architecture
1x 3 GHz – Cortex-A78 3x 2.6 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
3000 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G77 MP9
GPU frequency
850 MHz
Max display resolution
2520 x 1080
FLOPS
0.9792 TFLOPS
Execution units
9
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 19
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
34.1 Gbit/s

Miscellaneous

Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 3.0

Geekbench 6

Single Core
1252
Multi Core
3457

AnTuTu 10

691386

Compared to Other SoC

47%
56%
80%
Better then 47% SOC over the past year
Better then 56% SOC over the past 3 years
Better then 80% SOC

SiliconCat Rating

46
Ranks 46 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 1300
MediaTek, March 2022
1252
Exynos 1280
Samsung, March 2022
852
Tiger T700
Unisoc, March 2021
430
Exynos 850
Samsung, May 2020
223
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 1300
MediaTek, March 2022
3457
A10X Fusion
Apple, June 2017
2201
T606
Unisoc, September 2021
1397
Helio P35
MediaTek, December 2018
814
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 1300
MediaTek, March 2022
691386
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691

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