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HiSilicon Kirin 9020

HiSilicon Kirin 9020
HiSilicon Kirin 9020 is a SmartPhone Flagship platform from HiSilicon. It began to be released in December 2024. The SoC has 8 cores produced using 7 nm technology. And it also has a maximum frequency of 2500 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 35

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
December 2024
Manufacturing
SMIC
Model Name
Kirin 9020
Architecture
1x 2.5 GHz – TaiShan 3x 2.15 GHz – TaiShan 4x 1.6 GHz – TaiShan
Cores
8
Technology
7 nm
Frequency
2500 MHz
Instruction set
ARMv8-A

GPU Specifications

GPU name
Maleoon 920
GPU frequency
840 MHz
Max display resolution
3840 x 2160
Execution units
4

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR5
Memory frequency
2750 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
44 Gbit/s

Miscellaneous

L2 Cache
5 MB
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Storage type
UFS 3.1, UFS 4.0
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Da Vinci

AnTuTu 10

Score
1261005

Performance

CPU
Score
355420
GPU
Score
281302
Memory
Score
409061
UX
Score
215222
Show more

Geekbench 6

Single Core
1600
Multi Core
5367

Compared to Other SoC

44%
66%
86%
Better then 44% SOC over the past year
Better then 66% SOC over the past 3 years
Better then 86% SOC

SiliconCat Rating

35
Ranks 35 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
Kirin 9020
HiSilicon, December 2024
1600
Snapdragon 7 Gen 1
Qualcomm, May 2022
969
Snapdragon 730
Qualcomm, April 2019
698
Snapdragon 665
Qualcomm, April 2019
337
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Kirin 9020
HiSilicon, December 2024
5367
Dimensity 7025
MediaTek, April 2024
2521
Snapdragon 730G
Qualcomm, April 2019
1826
Snapdragon 636
Qualcomm, October 2017
1088
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 8350
MediaTek, November 2024
1417030
Kirin 9020
HiSilicon, December 2024
1261005
Exynos 1380
Samsung, February 2023
603635
Snapdragon 765G
Qualcomm, December 2019
441433