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HiSilicon Kirin 9020

HiSilicon Kirin 9020
HiSilicon Kirin 9020 is a SmartPhone Flagship platform from HiSilicon. It began to be released in December 2024. The SoC has 8 cores produced using 7 nm technology. And it also has a maximum frequency of 2500 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 38

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
December 2024
Manufacturing
SMIC
Model Name
Kirin 9020
Architecture
1x 2.5 GHz – TaiShan 3x 2.15 GHz – TaiShan 4x 1.6 GHz – TaiShan
Cores
8
Technology
7 nm
Frequency
2500 MHz
Instruction set
ARMv8-A

GPU Specifications

GPU name
Maleoon 920
GPU frequency
840 MHz
Max display resolution
3840 x 2160
Execution units
4

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR5
Memory frequency
2750 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L3 cache
10 MB
L2 Cache
5 MB
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Storage type
UFS 3.1, UFS 4.0
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Da Vinci

AnTuTu 10

Score
1261005

Performance

CPU
Score
355420
GPU
Score
281302
Memory
Score
409061
UX
Score
215222
Show more

Geekbench 6

Single Core
1600
Multi Core
5367

Compared to Other SoC

44%
63%
85%
Better then 44% SOC over the past year
Better then 63% SOC over the past 3 years
Better then 85% SOC

SiliconCat Rating

38
Ranks 38 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
Kirin 9020
HiSilicon, December 2024
1600
Snapdragon 778G
Qualcomm, May 2021
981
Dimensity 700
MediaTek, November 2020
715
Kirin 710F
HiSilicon, January 2019
355
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Kirin 9020
HiSilicon, December 2024
5367
Dimensity 7200
MediaTek, February 2023
2651
Snapdragon 732G
Qualcomm, August 2020
1847
Kirin 710A
HiSilicon, June 2020
1135
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 9200
MediaTek, November 2022
1497795
Kirin 9020
HiSilicon, December 2024
1261005
Snapdragon 855 Plus
Qualcomm, July 2019
611952
Dimensity 6400
MediaTek, February 2025
450493