Top 500

MediaTek Dimensity 800

MediaTek Dimensity 800

MediaTek Dimensity 800 is a SmartPhone Mid range platform from MediaTek. It began to be released in December 2019. The SoC has 8 cores produced using 7 nm technology. And it also has a maximum frequency of 2000 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 107

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
December 2019
Manufacturing
TSMC
Model Name
MT6873
Architecture
4x 2 GHz – Cortex-A76 4x 2 GHz – Cortex-A55
Cores
8
Technology
7 nm
Frequency
2000 MHz
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G57 MP4
GPU frequency
650 MHz
Max display resolution
2520 x 1080
FLOPS
0.3328 TFLOPS
Execution units
4
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 18
5G support
Yes
Bluetooth
5.1
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit
Max Bandwidth
17.07 Gbit/s

Miscellaneous

L2 Cache
1 MB
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Max camera resolution
1x 64MP, 2x 16MP
Storage type
UFS 2.2
Video codecs
H.264, H.265, VP9
Video playback
2K at 30FPS
Video capture
2K at 30FPS
Neural processor (NPU)
Yes
TDP
8 W

Geekbench 6

Single Core
644
Multi Core
2276

FP32 (float)

342

Compared to Other SoC

7%
15%
50%
Better then 7% SOC over the past year
Better then 15% SOC over the past 3 years
Better then 50% SOC

SiliconCat Rating

107
Ranks 107 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9300
MediaTek, November 2023
2225
Snapdragon 780G
Qualcomm, March 2021
1045
Helio G99
MediaTek, May 2022
733
Dimensity 800
MediaTek, December 2019
644
MT6750
MediaTek, August 2016
138
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Tensor
Google, October 2021
3234
Dimensity 800
MediaTek, December 2019
2276
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
FP32 (float)
Snapdragon 845
Qualcomm, December 2017
749
Snapdragon 690
Qualcomm, June 2020
501
Dimensity 800
MediaTek, December 2019
342
Kirin 810
HiSilicon, June 2019
239
Kirin 950
HiSilicon, November 2015
118