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MediaTek Dimensity 8050

MediaTek Dimensity 8050

MediaTek Dimensity 8050 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2023. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 3000 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 60

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2023
Manufacturing
TSMC
Model Name
MT6893, MT6893Z_T/CZA
Architecture
1x 3 GHz – Cortex-A78 3x 2.6 GHz – Cortex-A78 4x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
3000 MHz
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G77 MP9
GPU frequency
850 MHz
Max display resolution
2520 x 1080
FLOPS
0.9792 TFLOPS
Execution units
9
Shading units
64
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 21
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
34.1 Gbit/s

Miscellaneous

Audio codecs
AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 200MP
Storage type
UFS 3.1
Video codecs
H.264, H.265, AV1, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek APU 570

Geekbench 6

Single Core
1119
Multi Core
3242

AnTuTu 10

702079

Compared to Other SoC

41%
46%
74%
Better then 41% SOC over the past year
Better then 46% SOC over the past 3 years
Better then 74% SOC

SiliconCat Rating

60
Ranks 60 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Dimensity 7200
MediaTek, February 2023
1188
Dimensity 8050
MediaTek, May 2023
1119
Helio G91
MediaTek, June 2024
433
Snapdragon 653
Qualcomm, October 2016
226
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Snapdragon 870
Qualcomm, January 2021
3336
Dimensity 8050
MediaTek, May 2023
3242
Helio G91
MediaTek, June 2024
1403
Helio P23
MediaTek, August 2017
822
AnTuTu 10
Dimensity 9400
MediaTek, November 2024
3553537
Kirin 9010
HiSilicon, April 2024
950322
Dimensity 8050
MediaTek, May 2023
702079
Snapdragon 845
Qualcomm, December 2017
462034
Snapdragon 480 5G
Qualcomm, January 2021
363691

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