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MediaTek Dimensity 9400e

MediaTek Dimensity 9400e
MediaTek Dimensity 9400e is a SmartPhone Flagship platform from MediaTek. It began to be released in May 2025. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3400 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
Top SOC: 27

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
May 2025
Manufacturing
TSMC
Model Name
Dimensity 9400e
Architecture
1x 3.4 GHz – Cortex-X4
3x 2.85 GHz – Cortex-X4
4x 2 GHz – Cortex-A720
Cores
8
Technology
4 nm
Frequency
3400 MHz
Transistor count
22.7
Instruction set
ARMv9.2-A

GPU Specifications

GPU name
Mali-G720 Immortalis MP12
GPU frequency
1300 MHz
Max display resolution
3840 x 2160
FLOPS
3.9936 TFLOPS
Shading units
128
OpenCL version
3.0
Vulkan version
1.3
DirectX version
12

Connectivity

Download speed
Up to 7300 Mbps
5G support
Yes
Bluetooth
6.0
Wi-Fi
7
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

L3 cache
8 MB
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
- H.264
- H.265
- AV1
- VP9
Video playback
8K at 30FPS, 4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
Neural processor (NPU)
MediaTek NPU 790

Geekbench 6

Single Core
2255
Multi Core
7331

FP32 (float)

3953

AnTuTu 10

2180853

Compared to Other SoC

69%
74%
90%
Better then 69% SOC over the past year
Better then 74% SOC over the past 3 years
Better then 90% SOC

SiliconCat Rating

27
Ranks 27 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Dimensity 9400e
MediaTek, May 2025
2255
Dimensity 7030
MediaTek, September 2023
1051
Dimensity 6300
MediaTek, April 2024
829
Helio G88
MediaTek, June 2021
427
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 9400e
MediaTek, May 2025
7331
Dimensity 7100
MediaTek, January 2026
2921
Snapdragon 750G
Qualcomm, September 2020
2099
Kirin 960
HiSilicon, October 2016
1385
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Dimensity 9400e
MediaTek, May 2025
3953
Snapdragon 870
Qualcomm, January 2021
1358
Snapdragon 780G
Qualcomm, March 2021
744
Snapdragon 6 Gen 3
Qualcomm, September 2024
486
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Dimensity 9400e
MediaTek, May 2025
2180853
Dimensity 8200
MediaTek, December 2022
938571
Dimensity 7300
MediaTek, May 2024
686609
T8300
Unisoc, March 2025
484395