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MediaTek Dimensity 9400e

MediaTek Dimensity 9400e
MediaTek Dimensity 9400e is a SmartPhone Flagship platform from MediaTek. It began to be released in May 2025. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3400 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
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Top SOC: 21

Basic

Label Name
MediaTek
Platform
SmartPhone Flagship
Launch Date
May 2025
Manufacturing
TSMC
Model Name
Dimensity 9400e
Architecture
1x 3.4 GHz – Cortex-X4 3x 2.85 GHz – Cortex-X4 4x 2 GHz – Cortex-A720
Cores
8
Technology
4 nm
Frequency
3400 MHz
Transistor count
22.7
Instruction set
ARMv9.2-A

GPU Specifications

GPU name
Mali-G720 Immortalis MP12
GPU frequency
1300 MHz
Max display resolution
3840 x 2160
FLOPS
3.9936 TFLOPS
Shading units
128
OpenCL version
3.0
Vulkan version
1.3
DirectX version
12

Connectivity

5G support
Yes
Bluetooth
6.0
Wi-Fi
7
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
68.2 Gbit/s

Miscellaneous

Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Max camera resolution
1x 320MP
Storage type
UFS 4.0
Video codecs
- H.264 - H.265 - AV1 - VP9
Video playback
8K at 30FPS, 4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
Neural processor (NPU)
MediaTek NPU 790

Geekbench 6

Single Core
2255
Multi Core
7331

FP32 (float)

3953

AnTuTu 10

2180853

Compared to Other SoC

62%
80%
92%
Better then 62% SOC over the past year
Better then 80% SOC over the past 3 years
Better then 92% SOC

SiliconCat Rating

21
Ranks 21 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9500
MediaTek, September 2025
3950
Dimensity 9400e
MediaTek, May 2025
2255
Kirin 990
HiSilicon, October 2019
971
Snapdragon 730G
Qualcomm, April 2019
701
Snapdragon 660
Qualcomm, May 2017
345
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 9400e
MediaTek, May 2025
7331
Dimensity 7350
MediaTek, July 2024
2634
Exynos 9810
Samsung, January 2018
1847
Helio X30
MediaTek, February 2017
1115
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Dimensity 9400e
MediaTek, May 2025
3953
Dimensity 8100
MediaTek, March 2022
1322
Dimensity 1080
MediaTek, October 2022
707
Kirin 8000
HiSilicon, October 2024
446
AnTuTu 10
Dimensity 9500
MediaTek, September 2025
3414872
Dimensity 9400e
MediaTek, May 2025
2180853
Snapdragon 870
Qualcomm, January 2021
828488
Snapdragon 855
Qualcomm, December 2018
610389
Helio G200
MediaTek, May 2025
449274