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Unisoc T760

Unisoc T760

Unisoc T760 is a SmartPhone Mid range platform from Unisoc. It began to be released in July 2024. The SoC has 8 cores produced using 6 nm technology. And it also has a maximum frequency of 2200 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

New this year
Top SOC: 99

Basic

Label Name
Unisoc
Platform
SmartPhone Mid range
Launch Date
July 2024
Manufacturing
TSMC
Model Name
T760
Architecture
4x 2.2 GHz – Cortex-A76 4x 2 GHz – Cortex-A55
Cores
8
Technology
6 nm
Frequency
2200 MHz
Instruction set
ARMv8-A

GPU Specifications

GPU name
Mali-G57 MP4
GPU frequency
650 MHz
FLOPS
0.3072 TFLOPS
Shading units
64
OpenCL version
2.0
Vulkan version
1.3

Connectivity

4G support
LTE Cat. 15
5G support
Yes
Bluetooth
5.0
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo

Memory Specifications

Memory type
LPDDR4X
Memory frequency
2133 MHz
Memory Bus
2x 16 Bit
Max Bandwidth
17.07 Gbit/s

Miscellaneous

Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Max camera resolution
1x 108MP
Storage type
eMMC 5.1, UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
Yes

Geekbench 6

Single Core
751
Multi Core
2366

AnTuTu 10

454691

FP32 (float)

304

Compared to Other SoC

13%
20%
55%
Better then 13% SOC over the past year
Better then 20% SOC over the past 3 years
Better then 55% SOC

SiliconCat Rating

99
Ranks 99 among all SOC on our website
Geekbench 6 Single Core
Dimensity 9200 Plus
MediaTek, May 2023
2093
Snapdragon 780G
Qualcomm, March 2021
1045
T760
Unisoc, July 2024
751
Exynos 9609
Samsung, May 2019
362
Helio A25
MediaTek, June 2018
152
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Dimensity 8050
MediaTek, May 2023
3242
T760
Unisoc, July 2024
2366
Helio G85
MediaTek, April 2020
1338
Snapdragon 650
Qualcomm, February 2015
750
AnTuTu 10
Kirin 9000S
HiSilicon, August 2023
932745
Snapdragon 855
Qualcomm, December 2018
609911
T760
Unisoc, July 2024
454691
A10 Fusion
Apple, September 2016
350844
Kirin 710A
HiSilicon, June 2020
236396
FP32 (float)
Dimensity 920
MediaTek, August 2021
691
Snapdragon 480 5G
Qualcomm, January 2021
426
T760
Unisoc, July 2024
304
Helio G90
MediaTek, July 2019
205
Helio G91
MediaTek, June 2024
97