Dimensity 7300
MediaTek Dimensity 7300 vs Qualcomm Snapdragon 7 Plus Gen 3
SoC Comparison Result
Below are the results of a comparison of the characteristics and performance of the MediaTek Dimensity 7300 and Qualcomm Snapdragon 7 Plus Gen 3 mobile processors. This comparison will help you determine which one best suits your needs.
Basic
Label Name
MediaTek
Qualcomm
Launch Date
May 2024
March 2024
Platform
SmartPhone Mid range
SmartPhone Mid range
Manufacturing
tsmc
TSMC
Model Name
Dimensity 7300
SM7675
Architecture
4x Arm Cortex-A78 up to 2.5GHz, 4x Arm Cortex-A55
1x 2.8 GHz – Cortex-X44x 2.6 GHz – Cortex-A7203x 1.9 GHz – Cortex-A520
Cores
8
8
Technology
4 nm
4 nm
Frequency
2500 MHz
2800 MHz
Instruction set
-
ARMv9.2-A
GPU Specifications
GPU name
Mali-G615 MC2
Adreno 732
GPU frequency
-
950 MHz
Max display resolution
WFHD+ @ 120Hz Full HD+ @ 144Hz
3840 x 2160
FLOPS
-
4.7308 TFLOPS
Execution units
-
2
Shading units
-
1536
OpenCL version
-
2.0
Vulkan version
-
1.3
DirectX version
-
12.1
Connectivity
4G support
-
LTE Cat. 24
5G support
-
Yes
Bluetooth
-
5.4
Wi-Fi
-
7
Navigation
-
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
Memory type
LPDDR4x LPDDR5
LPDDR5X
Memory frequency
Up to 6400Mbps
4800 MHz
Memory Bus
-
4x 16 Bit
Max Bandwidth
-
77 Gbit/s
Miscellaneous
Audio codecs
-
AAC, AIFF, CAF, MP3, MP4, WAV
Max camera resolution
200MP
1x 200MP
Storage type
UFS 3.1
UFS 4.0
Video codecs
H.264 HEVC VP-9
H.264, H.265, AV1, VP8, VP9
Video playback
-
8K at 60FPS, 4K at 120FPS
Video capture
4K30 (3840 x 2160)
8K at 30FPS, 4K at 120FPS
Neural processor (NPU)
NPU 655
Hexagon
Advantages
Dimensity 7300
- Newer Launch Date: May 2024 (May 2024 vs March 2024)
Snapdragon 7 Plus Gen 3
- Higher Frequency: 2800 MHz (2500 MHz vs 2800 MHz)
Geekbench 6
Single Core
Dimensity 7300
1060
Snapdragon 7 Plus Gen 3
+80%
1906
Multi Core
Dimensity 7300
2900
Snapdragon 7 Plus Gen 3
+84%
5330
AnTuTu 10
Dimensity 7300
711402
Snapdragon 7 Plus Gen 3
+109%
1485728
Related articles
Date:
05 July 2024
Date:
05 July 2024
MediaTek has expanded its line of mobile platforms by introducing the latest models Dimensity 7300 and Dimensity 7300X. These chips are designed for mid-range devices and are manufactured on a 4nm process technology, delivering superior power efficie...
SiliconCat Rating
62
Ranks 62 among all SOC on our website
18
Ranks 18 among all SOC on our website
Snapdragon 7 Plus Gen 3
