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HiSilicon Kirin 9000E

HiSilicon Kirin 9000E

HiSilicon Kirin 9000E is a SmartPhone Flagship platform from HiSilicon. It began to be released in October 2020. The SoC has 8 cores produced using 5 nm technology. And it also has a maximum frequency of 3130 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.

Top SOC: 47

Basic

Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
October 2020
Manufacturing
TSMC
Model Name
Kirin 9000E
Architecture
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55
Cores
8
Technology
5 nm
Frequency
3130 MHz
Transistor count
15.3
Instruction set
ARMv8.2-A

GPU Specifications

GPU name
Mali-G78 MP22
GPU frequency
759 MHz
Max display resolution
3840 x 2160
FLOPS
2.1373 TFLOPS
Execution units
22
Shading units
64
OpenCL version
2.0
Vulkan version
1.3
DirectX version
12

Connectivity

4G support
LTE Cat. 24
5G support
Yes
Bluetooth
5.2
Wi-Fi
6
Navigation
GPS, GLONASS, Beidou, Galileo, NAVIC

Memory Specifications

Memory type
LPDDR5
Memory frequency
2750 MHz
Memory Bus
4x 16 Bit
Max Bandwidth
44 Gbit/s

Miscellaneous

Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Storage type
UFS 3.1
Video codecs
H.264, H.265, VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
AI accelerator
TDP
6 W

Geekbench 6

Single Core
1176
Multi Core
3255

FP32 (float)

2115

Compared to Other SoC

32%
54%
78%
Better then 32% SOC over the past year
Better then 54% SOC over the past 3 years
Better then 78% SOC

SiliconCat Rating

47
Ranks 47 among all SOC on our website
Geekbench 6 Single Core
M4 iPad
Apple, May 2024
3729
Kirin 9000E
HiSilicon, October 2020
1176
Dimensity 810
MediaTek, August 2021
787
Snapdragon 821
Qualcomm, August 2016
391
Snapdragon 625
Qualcomm, February 2016
189
Geekbench 6 Multi Core
M4 iPad
Apple, May 2024
14530
Kirin 9000E
HiSilicon, October 2020
3255
Dimensity 6100 Plus
MediaTek, July 2023
1965
Snapdragon 670
Qualcomm, August 2018
1250
Helio A25
MediaTek, June 2018
708
FP32 (float)
Dimensity 9300 Plus
MediaTek, May 2024
6050
Kirin 9000E
HiSilicon, October 2020
2115
Snapdragon 845
Qualcomm, December 2017
749
Snapdragon 690
Qualcomm, June 2020
501
Dimensity 800
MediaTek, December 2019
342