Top 500

MediaTek Dimensity 6500

MediaTek Dimensity 6500
MediaTek Dimensity 6500 is a SmartPhone Mid range platform from MediaTek. It began to be released in May 2026. The SoC has Octa (8) cores produced using 6 nm technology. And it also has a maximum frequency of Up to 2.6GHz. Its characteristics, as well as benchmark results, are presented in more detail below.
New this year
Top SOC: 150

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
May 2026
Model Name
MediaTek Dimensity 6500
Architecture
2x Arm Cortex-A76 @ 2.6GHz + 6x Arm Cortex-A55 @ 2.0GHz
Cores
Octa (8)
Technology
6 nm
Frequency
Up to 2.6GHz

GPU Specifications

GPU name
Arm Mali-G57 MC2
GPU frequency
Up to 1.1GHz
Max display resolution
2520 x 1080

Connectivity

Cellular specific functions
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 2CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback
Cellular technologies
2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA
Downlink functions
NR DL 2CC, 140 MHz bandwidth, 8-layer DL MIMO
Download speed
3.3Gbps
Modem power saving technologies
MediaTek 5G UltraSave 3.0+
Uplink functions
256QAM NR UL 2CC
Wi-Fi antenna
1T1R
4G support
4G FDD / TDD, 4G-CA
5G support
5G FDD / TDD, SA / NSA, 5G-CA
Bluetooth
Bluetooth 5.2 + Long Range
Wi-Fi
Wi-Fi 5 (a/b/g/n/ac)
Navigation
GPS L1CA+L5, BeiDou B1I+B2a, Glonass L1OF, Galileo E1+E5a, QZSS L1CA+L5, NavIC

Memory Specifications

Memory type
LPDDR4x
Memory frequency
2133MHz

Miscellaneous

Max camera resolution
Native 108MP; 16MP + 16MP
Storage type
UFS 2.2
Display refresh rate
Up to 120Hz

Geekbench 6

Single Core
845
Multi Core
2143

FP32 (float)

141

Compared to Other SoC

5%
12%
46%
Better then 5% SOC over the past year
Better then 12% SOC over the past 3 years
Better then 46% SOC

SiliconCat Rating

150
Ranks 150 among all SOC on our website
Geekbench 6 Single Core
Snapdragon 8s Gen 3
Qualcomm, March 2024
1638
Dimensity 7300
MediaTek, May 2024
1060
Dimensity 6500
MediaTek, May 2026
845
Snapdragon 710
Qualcomm, May 2018
446
Helio X23
MediaTek, January 2017
242
Geekbench 6 Multi Core
Kirin 9010
HiSilicon, April 2024
4560
Snapdragon 7s Gen 2
Qualcomm, September 2023
2954
Dimensity 6500
MediaTek, May 2026
2143
Tiger T700
Unisoc, March 2021
1442
Exynos 7420
Samsung, April 2015
840
FP32 (float)
Snapdragon 821
Qualcomm, August 2016
344
Exynos 8890
Samsung, November 2015
246
Dimensity 6500
MediaTek, May 2026
141
Helio G81
MediaTek, August 2024
90
Exynos 7904
Samsung, February 2019
48

Related SoC Comparisons