Top 50

MediaTek Dimensity 8500

MediaTek Dimensity 8500
MediaTek Dimensity 8500 is a SmartPhone Mid range platform from MediaTek. It began to be released in January 2026. The SoC has 8 cores produced using 4 nm technology. And it also has a maximum frequency of 3400 MHz. Its characteristics, as well as benchmark results, are presented in more detail below.
New this year
Top SOC: 35

Basic

Label Name
MediaTek
Platform
SmartPhone Mid range
Launch Date
January 2026
Manufacturing
TSMC
Model Name
Dimensity 8500
Architecture
1x 3.4 GHz – Cortex-A725
3x 3.2 GHz – Cortex-A725
4x 2.2 GHz – Cortex-A725
Cores
8
Technology
4 nm
Frequency
3400 MHz
Instruction set
ARMv9.2-A

GPU Specifications

GPU name
Mali-G720 MP8
Max display resolution
2960 x 1440
Shading units
128
OpenCL version
3.2
Vulkan version
1.3
DirectX version
12

Connectivity

5G support
Yes
Bluetooth
6.0
Wi-Fi
7
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

Memory type
LPDDR5X
Memory frequency
4266 MHz
Memory Bus
4x 16 Bit

Miscellaneous

Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
Max camera resolution
1x 320MP, 3x 32MP
Storage type
UFS 4.0, UFS 4.1
Video codecs
- H.264
- H.265
- AV1
- VP9
Video playback
4K at 60FPS
Video capture
4K at 60FPS
Neural processor (NPU)
MediaTek NPU 880

Geekbench 6

Single Core
1745
Multi Core
6694

AnTuTu 10

2431690

Compared to Other SoC

56%
67%
87%
Better then 56% SOC over the past year
Better then 67% SOC over the past 3 years
Better then 87% SOC

SiliconCat Rating

35
Ranks 35 among all SOC on our website
Geekbench 6 Single Core
M5 iPad
Apple, October 2025
4217
Dimensity 8500
MediaTek, January 2026
1745
Snapdragon 6 Gen 3
Qualcomm, September 2024
1011
T820
Unisoc, November 2022
764
Kirin 960
HiSilicon, October 2016
408
Geekbench 6 Multi Core
M5 iPad
Apple, October 2025
15421
Dimensity 8500
MediaTek, January 2026
6694
Snapdragon 782G
Qualcomm, November 2022
2839
Exynos 1280
Samsung, March 2022
1927
Kirin 710F
HiSilicon, January 2019
1255
AnTuTu 10
Snapdragon 8 Gen 5
Qualcomm, November 2025
3525943
Dimensity 8500
MediaTek, January 2026
2431690
Kirin 9000
HiSilicon, October 2020
892503
Snapdragon 860
Qualcomm, April 2019
648720
Exynos 9810
Samsung, January 2018
472103